Motorola Corporation

Freescale Semiconductor,inc.

Russell Thomas Lee

William H Lytle

Jerry Lynn White

Ravichandran Subrahmanyan

Thomas A Scharr

A method for performing failure analysis on a semiconductor device under inspection includes preparing of a device sample using an encapsulation material containing a dye, the prepared device sample possibly including a failure area having wicked in encapsulation material containing the dye. The prepared device sample is then sectioned to facilitate viewing a cross section face of the device under inspection. Lastly, a dark field analysis on the prepared device sample is performed with the use of dark field illumination. Responsive to at least one failure area containing wicked in encapsulation material with dye occurring on the cross section face of the device under inspection, the failure area can be readily identified as well as a contrast and perspective of remaining portions of the cross section face being maintained.

Method and apparatus for performing failure analysis with fluorescence inks

Apparatus and a method of cold cross-sectioning soft materials includes providing a chuck attached to a drive motor with a composite plate attached to the chuck and including a heat insulating portion, a heat conducting layer, and a central axially extending duct with a plurality of radially extending conduits in communication therewith, the central axially extending duct is accessible externally for introducing a cooling liquid thereto. A sheet of grinding material is magnetically attached to the composite plate and the drive motor is activated to rotate the composite plate and grinding material. A cooling liquid is introduced into the duct and communicated to the conduits and a lubricant is supplied to the exposed rotating surface of grinding material.

Apparatus and method for cold cross-sectioning of soft materials

A method for flip-chip bonding an integrated circuit die to a substrate. A substrate (21) having conductive bonding areas (22) coated with tin (23) is secured to a bottom end effector of a flip-chip bonding apparatus. An integrated circuit die (26) having gold bumps (28) is secured to a die tool of the flip-chip bonding apparatus. A gold-tin eutectic bond is formed between the integrated circuit die (26) and the conductive bonding areas (22) of the substrate (21).

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Phoenix, AZ, United States of America

Russell Thomas Lee