Amkor Technology, Inc.

Russell Shumway

Bob Shih-Wei Kuo

Louis B Troche, Jr

Marc Alan Mangrum

Bora Baloglu

Mahmoud Dreiza

Adrian Arcedera

Andrew Ballantine

Brett Arnold Dunlap

Shaun Bowers

Ahmer Raza Syed

Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

Embedded vibration management system having an array of vibration absorbing structures

Embedded vibration management system

A method includes mounting a window substrate to a carrier tape. The window substrate has a window extending between an upper surface of the window substrate and a lower surface of the window substrate, the carrier tape sealing the window at the lower surface. Bond pads on an active surface of a MEMS die are flip chip mounted to terminals on the upper surface of the window substrate, a MEMS active area of the MEMS die being aligned with the window of the window substrate. A magnet is mounted to an inactive surface of the MEMS die.

MEMS package with MEMS die, magnet, and window substrate fabrication method and structure

A microfluidics sensor package includes a microfluidics sensor die having an active surface, bond pads on the active surface, and an active area on the active surface. A standoff pattern is formed on the active surface to extend to a precise height above the active surface. A lid is mounted to the standoff pattern by a lid adhesive. By using the standoff pattern to precisely space the lid above the active surface, a microfluidics cavity between the lid and the active surface is precisely created allowing for precise control of fluid flowing through the microfluidics cavity. By precisely controlling the flow of fluid through the microfluidics cavity, accurate results, e.g., of the laboratory functions performed on the fluid, are provided.

Microfluidics sensor package fabrication method and structure

Methods and systems for a molded cavity substrate Micro Electro Mechanical Systems (MEMS) package may comprise a MEMS electronic component, a base substrate comprising a first conductive through via, a molded ring coupled to the base substrate, and a lid substrate comprising dielectric material and a metal layer. The molded ring comprises a second conductive through via and a molded cavity, and the MEMS electronic component is located within the molded cavity. The base substrate may comprise a laminate substrate. The lid substrate may comprise a cavity port. A base assembly mounting adhesive may couple an inner surface of the lid to a principal surface of the molded ring. The dielectric material may comprise mold material. The molded ring may comprise mold compound adherent to an outer region of an inner surface of the base substrate with a central region of the base substrate exposed by the molded ring.

Molded cavity substrate MEMS package fabrication method and structure

A metal mesh lid MEMS package includes a substrate, a MEMS electronic component coupled to the substrate, and a metal mesh lid coupled to the substrate with a lid adhesive. The metal mesh lid includes a polymeric lid body having a top port formed therein and a metal mesh cap coupled to the lid body. The metal mesh cap covers the top port and serves as both a particulate filter and a continuous conductive shield for EMI/RF interferences. Further, the metal mesh cap provides a locking feature for the lid adhesive to maximize the attach strength of the metal mesh lid to the substrate.

Metal mesh lid MEMS package and method

A molded ring includes a molded cavity of a molded cavity substrate MEMS package. The molded ring is formed by molding a dielectric material directly upon a substrate. As molding is a relatively simple and low cost process, the molded ring and thus molded cavity are formed at a minimal cost. This, in turn, minimizes the cost of the molded cavity substrate MEMS package.

A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.

Growing community of inventors

Mesa, AZ, United States of America

Russell Shumway