Delphi Technologies, Inc.

Mahle International Gmbh

Russell S Johnson

Shrikant Mukund Joshi

Mohinder Singh Bhatti

Yanping Xia

Ilya Reyzin

Wayne Oliver Forrest

Douglas Charles Wintersteen

Donald Robert Pautler

David E Samuelson

Joel Thomas Hambruch

Henry Goodman

Joseph B Czach

The disclosure presents a heat exchanger assembly having a first manifold, a second manifold spaced from the first manifold, a plurality of refrigerant tubes extending between and in hydraulic communication with the first and second manifolds, a plurality of corrugated fins inserted between the plurality of refrigerant tubes, and a condensate extractor having a comb baffle portion with fingers inserted between the plurality of refrigerant tubes and a conveyance portion. The comb baffle portion is configured to extract condensate from between the plurality of refrigerant tubes and the conveyance portion is configured to convey condensate away from the heat exchanger assembly.

Heat exchanger having a condensate extractor

A heat pump heat exchanger includes a first manifold, a second manifold spaced from the first manifold, a plurality of refrigerant tubes hydraulically connecting the manifolds, and a distribution tube disposed in the first manifold. The distribution tube includes an inlet end, a distal end opposite the inlet end, a plurality of orifices between the inlet end and the distal end. The distribution tube also includes a terminal aperture immediately adjacent the distal end, wherein the terminal aperture includes an open aperture area greater than any one of the open orifice area. The open aperture area is large enough to provide a uniform refrigerant collection with acceptable minimal pressure drop in evaporative mode, but small enough to prevent vapor overflow to an area of the manifold adjacent to the distal end in condenser mode. The length of the distribution tube is less than &#xbe; the length of the first manifold.

Heat pump heat exchanger having a low pressure drop distribution tube

The subject invention provides a heat sink for a liquid cooled cooling assembly for removing heat generated by an electronic device. The heat sink includes a flow diverter having a hyperbolic cross section disposed on a base for absorbing a significant portion of the heat from the electronic device. An inlet tube directs an impinging flow of cooling fluid directly onto the flow diverter to remove the heat stored within the flow diverter. A spiral wall extends in an increasing spiral from the flow diverter to define a spiral channel for discharging the flow of cooling fluid. The spiral wall includes a plurality of louvers for creating turbulence in the flow of cooling fluid for maintaining a high heat transfer coefficient between the spiral wall and the cooling fluid.

Cooling assembly with spirally wound fin

Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on another surface, at least two fins and porous reticulated foam blocks having intervening gaps that fill the width and at least a portion of the length between the fins. The foam block may be a continuous single block within the space between two adjacent fins along the length of the fins or may be an array of short-length blocks having intervening gaps along the length of the fins.

High-performance heat sink for electronics cooling

Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins arranged radially around the spreader plate and an array of porous reticulated foam blocks that fills the space between adjacent fins.

High performance heat sink for electronics cooling

The present invention is directed to liquid-cooled or air-cooled metallic heat sinks formed as unibody structures that include a planar base and upright fins. The fins are located on one side of the heat sink and the ratio of fin spacing to fin height is low. In order to achieve low value of the ratio of fin spacing to fin height, a fin density of greater than about twelve fins per centimeter is employed. The length of the fins in the flow direction is restricted in order to yield high rate of heat dissipation from the finned surface. Furthermore, flow of the cooling fluid over the fins is maintained laminar in order to reduce the noise level and pumping power for the fluid.

Growing community of inventors

Tonawanda, NY, United States of America

Russell S Johnson