Intel Corporation

Dell Products Inc.

Intel Corproation

Russell S Aoki

Anthony P Valpiani

Thomas A Boyd

Michael Hui

Mark E Sprenger

David Pidwerbecki

Mark Angus MacDonald

Daniel P Carter

Shelby A Ferguson

John Trevor Morrison

Chia-Pin Chiu

Gerald Rene Pelissier

Michael T Crocker

David W Browning

Jeffory L Smalley

Ralph V Miele

Donald Tiendung Tran

Shawn McEuen

Kevin Ceurter

Karumbu Meyyappan

Jonathon Robert Carstens

Rashelle Yee

Joseph J Jasniewski

Aleksander Magi

Paul J Gwin

Jeff Ku

Jeremy N Burr

Srikant Nekkanty

Dimitrios Ziakas

Devdatta P Kulkarni

Jonathan W Thibado

Feifei Cheng

Alan W Tate

Ralph W Jensen

Patrick S Johnson

Nicolas A Kurczewski

Harvey R Kofstad

Mohammed N Haq

Barry T Dale

Sheng-Chao Lin

Matthew James Adiletta

Don J Nguyen

Nicholas Waddell Oakley

Achintya K Bhowmik

Rajiv K Mongia

Aaron Gorius

Hong Xie

Ketan R Shah

Gaurav Chawla

Stephen Dylan Berry

Nithyananda Siva Jeganathan

David J Llapitan

Kuang C Liu

Gregorio R Murtagian

Tod A Byquist

James W Edwards

Robin A Steinbrecher

Eric W Buddrius

Michael Zack Eckblad

Bijoyraj Sahu

Eric Dwight McAfee

Feroz Mohammad

Daria A Loi

Michael Ahrens

Michael S Brazel

Mustafa H Haswarey

Meenakshi Gupta

Rolf Laido

Brian R Peil

Hongfei Yan

Tommy S Montoya

Daniel Neumann

Richard Zhao

Correy D Cooks

Saara Kamppari

Yong Wang

Casey G Thielen

Konomi Shimada

Rachel Taylor

Curtis J Koepsell

Grant F Steen

Marshall Grinstead

Gabriel G Khouri

Shmuel M Eden

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Racks and rack systems to support a plurality of sleds are disclosed herein. A rack comprises an elongated support post and a plurality of support chassis. The elongated support post extends vertically. The plurality of support chassis are coupled to the elongated support post. Each support chassis of the plurality of support chassis is sized to house a corresponding sled of the plurality of sleds.

Pivot rack

Sleds for operation in racks of data centers are disclosed herein. A sled includes a circuit board substrate, one or more physical resources, and one or more memory devices. The circuit board substrate has a top side and a bottom side arranged opposite the top side. The one or more physical resources are coupled to the top side of the circuit board substrate. The one or more memory devices are coupled to the bottom side of the circuit board substrate. Additionally, the sled includes a connector to electrically couple the one or more physical resources to the one or more memory devices.

Memory and power mezzanine connectors

An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.

Top-side connector interface for processor packaging

A data connector to interface with a sled of a data center includes a main body, a plurality of guide shafts, and a cover. The main body includes electrical contacts. The guide shafts are associated with the main body, and each guide shaft extends along a corresponding longitudinal axis. The cover is coupled to the guide shafts such that the cover is slidable along the guide shafts in a direction defined by the longitudinal axes. The cover includes a movable door to provide protection to the electrical contacts of the main body when not in use.

Data connector with movable cover

Particular embodiments described herein provide for an electronic system that includes a docking station configured to wirelessly couple to an electronic device and a wireless charging element removably coupled to the docking station. The wireless charging element includes a power receiving unit and is configured to wireless charge the electronic device. In an example, the docking station is configured for high speed input/output.

Docking station

Semiconductor packages with programmable routing pathways are disclosed. The semiconductor package may have a source trace that may be electrically coupled to two or more different electrical pathways, where any of the electrical pathways may be activated to provide an electrical connection between the source trace and one or more destination nodes. Each of the electrical pathways may have a corresponding metal well with a correspond airgap overlying the metal well, as well as corresponding heating elements. If a particular heating element is energized, the heating element may melt metal in a corresponding metal well and the molten metal may migrate by capillary action into the overlying airgap to complete an electrical connection between the source trace and a destination node.

Semiconductor package with programmable signal routing

Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

Connector for processor package

Configurable semiconductor packages and processes to attain a defined configuration are provided. A configurable semiconductor package includes a base semiconductor package including a semiconductor die mounted on a surface of a package substrate. An expansion package can be mechanically coupled to a mounting member. The expansion package includes a second package substrate and one or more second semiconductor dies that can be surface mounted to the second package substrate. The second package substrate include an array of interconnects that permit coupling (mechanically and/or electrically) the second semiconductor die(s) to the package substrate of the base semiconductor package. The mounting member can mechanically attach to the base semiconductor package, resulting in a package assembly that has the array of interconnects adjacent to another array of interconnects in the package substrate of the base semiconductor package. The expansion package can be coupled to the base semiconductor package via the interconnects, providing expanded functionality relative to the functionality of the base semiconductor package.

Configurable semiconductor package

Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

Stacking detachable tablet

Hinge having multiple degrees of freedom

Particular embodiments described herein provide for an electronic device that includes a flexible display and a support for the flexible display. The support includes a main support structure, at least one curve crease, and a curve region, wherein the curve region includes a curve support.

Flexible display structure

Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.

Integrated circuit packages with temperature sensor traces

A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

Rework grid array interposer with direct power

Particular embodiments described herein provide for an electronic device, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a main housing, a flexible display, and a touchscreen, wherein regions of the touchscreen can be reconfigured based on an orientation of the flexible display.

Touchscreen for use with flexible display

Growing community of inventors

Kent, WA, United States of America

Russell S Aoki