International Business Machines Corporation

Russell H Lewis

Craig G Heim

Mark Vincent Pierson

Karl J Puttlitz, Sr

Christian Robert Le Coz

Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Apparatus for manufacturing circuit boards

System for replacing a first area array component connected to an

A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

Method for restraining circuit board warp during area array rework

An apparatus for heating a module mounted on a card includes a heating chamber adapted to receive the card and module, a nozzle adapted to surround the module and provide a flow of heated gas thereover, and a heated support surface for heating a bottom surface of a card immediately underlying the module. The method of removing and replacing a module on a card includes preheating the card and module prior to heating the contact sites to a solder reflow temperature and also preheating a card and a replacement module to an equilibrium temperature prior to increasing the temperature of the contact sites to the reflow temperature. The apparatus and method embodying the present invention effectively addresses the problem of providing a faster heating cycle, and a more even temperature distribution across the contact sites of the module and card.

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Fort Collins, CO, United States of America

Russell H Lewis