Cree Gmbh

Other

Russell George Villard

Nicholas William Medendorp, Jr

Norbert Hiller

Robert E Higley

Joshua J Markle

Nicholas Desilva

Yuming Chen

Lawrence Maurice Roberts, Jr

John C Perry

Shawn Patrick Keeney

A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a support plate and a plurality of panels Connected to the support plate. Each panel has an array of LEDs mounted to a planar surface thereof, and each of the panels is rotatable in at least two dimensions.

LED lighting fixture

Multi-configurable, high luminous output light fixture systems, devices, and methods are disclosed. Light fixtures can be configured to produce variable light emission outputs and patterns and can include LED packages wherein at least one can be movable with respect to another of the LED packages. In addition, a power supply can selectively dim or turn off at least one of the LED packages. The light fixtures disclosed herein can be used in both high bay and low bay light fixtures.

Multi-configurable, high luminous output light fixture systems, devices and methods

A LED lighting device includes at least one waveguide element and multiple light-emitting sources such as LEDs or LED packages, which may be optically coupled though different light entry regions to the at least one waveguide. Multiple light solid state sources may be arranged in strips. A waveguide system includes first and second body structures each positioned to illuminate at least a portion of a target surface. One or more waveguides may be arranged to illuminate a LCD panel.

LED lighting devices incorporating waveguides

Techniques for light emitting diode (LED) lighting with heat spreading in illumination gaps. Inexpensive structural aluminum may be suitably employed to form a passive heat spreading mount for plural LEDs whose illumination collectively combines to provide the light needed by a particular lighting fixture, such as a pendant chandelier, by way of example, by angling fins of the passive heat spreading mount to correspond to illumination gaps of the LEDs.

Methods and apparatus for LED lighting with heat spreading in illumination gaps

Light-emitting die (LED) Lamps, heat sinks, and related methods are provided. An LED lamp can include a mounting substrate having a top surface, a bottom surface and side edges. An LED package can be disposed on the top surface of the mounting substrate with the LED package comprising an LED chip. The LED lamp can include a heat sink that can include a heat sink base and a spacer extending upward from the base. The spacer can have a mounting area or pad distal from the heat sink base on which the bottom surface of the mounting substrate is disposed. The spacer can also have a width that is less than a width between the side edges of the mounting substrate. The LED lamp can further include a lens disposed over the LED package and the mounting substrate.

Light emitting die (LED) lamps, heat sinks and related methods

A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

LED backlight system for LCD displays

A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.

Provided are light emitting apparatus including a solid state light emitting element having a first side and a second side, the solid state light emitting element configured to emit light from the first side. Such apparatus further include an elongated thermally conductive element positioned to conduct thermal energy from the second side of the solid state light emitting element.

Thermal transfer in solid state light emitting apparatus and methods of manufacturing

One or more solid state light emitting elements are mounted on a hardcoat anodized aluminum substrate. One or more bars also may be provided that slidably contact an edge of the hardcoat anodized aluminum substrate. The substrate and the bar(s) may be mounted in a housing with the bars mounted in apertures in the housing wall. Related assembling methods for solid state light emitting apparatus also are disclosed.

High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods

Lighting packages are described for light emitting diode (LED) lighting solutions having a wide variety of applications which seek to balance criteria such as heat dissipation, brightness, and color uniformity. The present approach includes a backing of thermally conductive material and two or more arrays of LEDs attached to a printed circuit board (PCB). The PCB is attached to the top surface of the backing and the two or more arrays of LEDs are separated by a selected distance to balance heat dissipation and color uniformity of the LEDs.

Light emitting diode packages

A modular LED lighting fixture is provided, where the shape and brightness of light output from the fixture can be altered by changing LED modules and/or power supplies powering the modules within the fixture. The fixture can include a housing, a modular, removable LED module attached within the housing, and at least one modular, removable power supply attached to the housing for powering the LED module.

Growing community of inventors

Apex, NC, United States of America

Russell George Villard