Milliken + Co

Lord Corporation

Russell A Stapleton

Yunzhang Wang

Yuzhou Liu

Eduardo Torres

Michael Wilson

Sudhanshu Srivastava

Richard Lawson

Sasha Stankovich

Xinfei Yu

Robbie W J M Hanssen

Robbie W J Hanssen

Cliferson Thivierge

Eric B Monroe

Melissa R Kern

Matthew W Smith

A method for producing a cross-linked siloxane network comprises the steps of: (a) providing a first part comprising (i) a first siloxane compound comprising at least one cyclic siloxane moiety and (ii) a second siloxane compound comprising a plurality of siloxane moieties, (b) providing a second part, the second part comprising a hydroxide salt, (c) combining the first part and the second part to produce a reaction mixture, (d) heating the reaction mixture to a temperature sufficient for the hydroxide salt to open the ring of the cyclic siloxane moiety, and (e) maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react to produce a cross-linked siloxane network.

Method for producing a cross-linked siloxane network

A method for producing a cross-linked siloxane network comprises the steps of: (a) providing a first part comprising (i) a first siloxane compound comprising at least one cyclic siloxane moiety, (ii) an inorganic particulate material, and (iii) an aminosilane compound, (b) providing a second part, the second part comprising a hydroxide salt, (c) combining the first part and the second part to produce a reaction mixture, (d) heating the reaction mixture to a temperature sufficient for the hydroxide salt to open the ring of the cyclic siloxane moiety, and (e) maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react to produce a cross-linked siloxane network.

A composition comprises a first siloxane compound comprising at least one cyclic siloxane moiety and a first salt, the first salt comprising a conjugate base of a volatile organic acid. A method for producing a cross-linked siloxane network comprises the steps of providing a first siloxane compound comprising at least one cyclic siloxane moiety, providing a first salt comprising a conjugate base of a volatile organic acid, combining the first siloxane compound and the first salt to produce a reaction mixture, heating the reaction mixture to a temperature sufficient for the first salt to open the ring of the cyclic siloxane moiety, and maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react with each other to produce a cross-linked siloxane network.

Compositions comprising siloxane compounds and methods for using the same

A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

Cross-linked silicone polymer and process for producing the same

Light emitting diode

In a first aspect of the present invention, a method for manufacturing a flip chip package is provided comprising the steps of a) providing a chip having electrically conductive pads on an active surface thereof, b) coating at least a portion the chip with a protectant composition comprising a polymerizable component comprising a thermosetting epoxy resin, at least 50 weight percent of a substantially transparent filler having a coefficient of thermal expansion of less than 10 ppm/&#xb0; C., a photoinitator, and a solvent carrier, wherein the protectant composition comprises a thixotropic index of less than 1.5, c) masking the coated chip to mask areas where vias through the protectant are desired, d) exposing the masked chip to a light source sufficient to partially crosslink the protectant composition in the unmasked areas, e) removing the uncured portions of the protectant composition thereby creating vias through the protectant composition to the electrically conductive pads on the surface of the chip, f) applying an electrically conductive material to the chip through the vias, wherein the electrically conductive material protrudes from the surface of the protectant composition, and g) heating the chip to a temperature sufficient to reflow the electrically conductive material and thermoset the protectant composition.

Methods for protecting a die surface with photocurable materials

Growing community of inventors

Spartanburg, SC, United States of America

Russell A Stapleton