Matsushita Electric Industrial Co., Ltd.

Russel S Sossong

Brian Massey

Michael J Powers

Trebor Heminway

A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.

Solder preform for low heat stress laser solder attachment

An apparatus aligns an optical fiber array, that has first and second ends, to an optical fiber light source at the first end of the optical fiber array by using an image of the second end of the optical fiber array captured by a CCD camera, while the first end of the optical fiber array is moved relative to the optical fiber light source. The apparatus includes a controller, coupled to an alignment stage which moves the first end of the optical fiber array and a variable optical attenuator located between the second end of the optical fiber array and the camera. The controller controls the fiber optic alignment device responsive to signals provided by the electronic camera. The camera is used for rough alignment and an optical power meter, coupled to the alignment stage is used for fine alignment.

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Shrewsbury, MA, United States of America

Russel S Sossong