Skyworks Solutions, Inc.

Russ Alan Reisner

Aleksey A Lyalin

David Viveiros, Jr

Weimin Sun

Jiunn-Sheng Guo

Guohao Zhang

Dinhphuoc Vu Hoang

Yu-Jui Lin

John C Baldwin

Ramon Antonio Beltran Lizarraga

Yang Li

Xuanang Zhu

Nicholas Quinn Muhlmeyer

Taesong Hwang

Bradley D Scoles

Dmitri Prikhodko

Robert Francis Darveaux

Joel Richard King

Daniel Lee Kaczman

Ziv Alon

Xiaodong Xu

Tin Wai Kwan

Howard E Chen

Andy Cheng Pang Wu

Tianming Chen

Yuan Cao

David Penunuri

James Phillip Young

Joji Fujiwara

Ki Wook Lee

Bradley Paul Barber

Takeshi Furusawa

Sundeep Nand Nangalia

Haibo Cao

Nai-Shuo Cheng

Sahana Kenchappa

Dimitri Prikhodko

Nobuyuki Tsujimoto

Jr David Viveiros

Front end architectures are described that tailor duplexer characteristics to enable the removal of many of the impedance matching components typically included in a receive signal path between an antenna and receive amplifiers and in a transmit signal path between transmit amplifiers and the antenna. By tailoring duplexer characteristics, targeted impedance matching can be achieved for front end architectures.

Reducing impedance matching components in front end architectures for multi-band transmit and receive functions

The disclosed front end architectures are configured to conglomerate duplexer transmission (TX) contours into a specific or targeted region. This enables the power amplifier (PA) to match a larger number of frequency bands without the help of additional matching networks. The disclosed architectures are advantageous because they reduce the number of components (e.g., surface mount technology components (SMTs)) required for radio-frequency (RF) modules, such as front end modules, power amplifier modules, and the like. The disclosed architectures are also advantageous because they improve performance of the modules across a wider range of frequency bands.

Conglomerating transmission contours to improve transmission performance for radio-frequency communications

Apparatus and methods for power amplifier output matching is disclosed. In one aspect, there is provided an output matching circuit including an input configured to receive an amplified radio frequency signal from a power amplifier, a first output, and a second output. The output matching circuit further includes a first matching circuit electrically connected between the input of the output matching circuit and the first output, the first matching circuit configured to suppress harmonics of a fundamental frequency of the amplified radio frequency signal when the amplified radio frequency signal is within a first band. The output matching circuit further includes a second matching circuit electrically connected between the input of the output matching circuit and the second output, the second matching circuit configured to suppress harmonics of the fundamental frequency of the amplified radio frequency signal when the amplified radio frequency signal is within a second band different from the first band.

Output matching circuit with suppressed harmonics

Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.

Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same

Power amplifier output matching with suppressed harmonics

Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Devices and methods related to nested filters

Apparatus and methods for power amplifier output matching

Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same

Power amplification system is disclosed. A power amplification system can include a Class-E push-pull amplifier including a transformer balun. The power amplification can further include a reactance compensation circuit coupled to the transformer balun. In some embodiments, the reactance compensation circuit is configured to reduce variation over frequency of a fundamental load impedance of the power amplification system.

Power amplification system with reactance compensation

Systems and methods related to linear load modulated power amplifiers. A power amplifier (PA) system can include a divider that splits a signal into two portions, a first portion directed to an attenuator that attenuates the first portion so that the first portion and the second portion have different powers and a second portion directed to a phase shift component that shifts a phase of the second portion so that the first portion and the second portion have different phases. The PA system can also include a Doherty amplifier circuit where a carrier amplifier amplifies the attenuated first portion and a peaking amplifier amplifies the phase-shifted second portion. The carrier amplifier includes a Class AB driver stage and a Class B output. The peaking amplifier includes a Class B driver stage a Class B output stage.

Methods for amplifying signals using a Doherty amplifier

In some embodiments, a power amplification system can include a common base amplifier configured to amplify an input signal received at an input node to generate an intermediate signal at an intermediate node. The power amplification system can further include a power amplifier configured to amplify the intermediate signal received at the intermediate node to generate an output signal at an output node.

Common base pre-amplifier

In an embodiment, an apparatus includes a first radio frequency (RF) signal path and a second RF signal path. The first RF signal path can provide a first RF signal when active and the second RF signal path can provide a second RF signal when active. The second RF signal path can include a matching network with a load impedance configured to prevent a resonance in the second RF signal path due to coupling with the first RF signal path when the first RF signal path is active.

Multi-band device with reduced band loading

In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.

Network with integrated passive device and conductive trace in packaging substrate and related modules and devices

Stacked wafer-level packaging devices. In some embodiments, a wireless device includes a transceiver configured to generate a radio-frequency (RF) signal. The wireless device also includes a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device. The wireless devices further includes an antenna in communication with the front-end module, the antenna configured to transmit the amplified radio-frequency signal.

Stacked wafer-level packaging devices

Growing community of inventors

Newbury Park, CA, United States of America

Russ Alan Reisner