Basf Aktiengesellschaft

Ruprecht Kroker

Gerhard Nestler

Hans Sander

Werner Schmitt

Winfried Schumm

Manfred Wiedemann

Hermann Gausepohl

Fritz E Kempter

Erich Gulbins

Ernst Hofmann

Armin Haag

Guenther Mueller

A tert-C&#x2013;C-alkyl (meth)acrylate is prepared by reacting (meth)acrylic acid with an olefin of the formulawhere The novel process makes it possible to use acetic acid-containing (meth)acrylic acid. The danger of cleavage of the ester and of polymerization of (meth)acrylic compounds is reduced.

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Method for producing tert-butyl esters of aliphatic c1-c4-carboxylic acids

A process for distillative separation of pure (meth)acrylic acid from mixtures which include comprise (meth)acrylic acid and dimers and oligomers of (meth)acrylic acid and are essentially free from aldehydes and from components whose boiling point is lower than that of (meth)acrylic acid, using a distillation apparatus which has a thin-film evaporator, a condenser and a connection which contains a baffle device and links the thin-film evaporator and the condenser.

Process for separating by distillation pure (meth)acrylic acid from mixtures

Liquid mixtures which contain (meth)acrylic acid as the main component are continuously separated in a distillation apparatus which comprises a still, a condenser and a connection between still and condenser and to which the liquid mixture to be separated is continuously fed, by a process in which the energy required for evaporation of the liquid mixture is supplied to the distillation apparatus by a procedure in which a part of the liquid content of the still is continuously removed, superheated and recycled to the still.

Continuous distillative separation of liquid mixtures which contain

Preparation of pure N-vinyl-2-pyrrolidone

The invention relates to baking finishes of low solvent content, consisting essentially of an acrylate resin, an eposy resin and a mixture of organic solvents, with or without pigment, catalyst and other conventional auxiliaries, in which the acrylate resin is a copolymer which contains from 10 to 35% by weight of .alpha.,.beta.-olefinically unsaturated carboxylic acids as copolymerized units, has a very low K value and has an acid number of from 70 to 250 mg of KOH/g, the epoxy resin contains at least 2 oxirane groups per molecule and the mixture of organic solvents is a mixture of from 20 to 80% by weight of a solvent having a boiling point of from 100.degree. to 280.degree. C. and a dielectric constant of from 2 to 4.99, and from 80 to 20% by weight of a solvent having a boiling point of from 80.degree. to 200.degree. C. and a dielectric constant of from 5 to 27. The weight ratio of acrylate resin to epoxy resin is from 9:1 to 6:4. The acrylate resin has a mean molecular weight Mn of from 1500 to 3000 and an inhomogeneity (Mw/Mn), measured by gel permeation chromatography, of from 1.5 to 2.0. These baking finishes of low solvent content may be used, e.g., as finishes for domestic equipment and as automotive primers.

Baking finishes of low solvent content

Pigment formulations and their use. The formulations contain pigments, organic solvents and from 10 to 80% by weight of a wetting agent consisting of a non-ionic organic compound which has a viscosity of from 500 to 10,000 mPa.s and has been produced by reacting an alkylated amide/formaldehyde reaction product and an epoxy resin, which may or may not be modified, in a weight ratio of from 9:1 to 1:9. They are used as additives in surface-coating binders, especially in cationic electrocoating finishes.

Pigment formulations for use in surface-coating binders

The invention relates to baking finishes of low solvent content, consisting essentially of an acrylate resin, an epoxy resin and a mixture of organic solvents, with or without pigment, catalyst and other conventional auxiliaries, in which the acrylate resin is a copolymer which contains from 10 to 35% by weight of .alpha.,.beta.-olefinically unsaturated carboxylic acids as copolymerized units, has a very low K value and has an acid number of from 70 to 250 mg of KOH/g, the epoxy resin contains at least 2 oxirane groups per molecule and the mixture of organic solvents is a mixture of from 20 to 80% by weight of a solvent having a boiling point of from 100.degree. to 280.degree. C and a dielectric constant of from 2 to 4.99, and from 80 to 20% by weight of a solvent having a boiling point of from 80.degree. to 200.degree. C and a dielectric constant of from 5 to 27. The weight ratio of acrylate resin to epoxy resin is from 9:1 to 6:4. These baking finishes of low solvent content may be used, e.g., as finished for domestic equipment and as automotive primers.

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Bobenheim-Roxheim, Germany

Ruprecht Kroker