Infineon Technologies Ag

Rupert Fischer

Joachim Mahler

Ralf Otremba

Reimund Engl

Bernd Rakow

Alexander Heinrich

Xaver Schloegel

Peter Strobel

Stefan Landau

Wae Chet Yong

Thomas Behrens

Konrad Roesl

Stanley Job Doraisamy

Tien Lai Tan

Eduard Knauer

Gerhard Deml

Methods for connecting chips to a chip carrier are disclosed. In some embodiments the method for connecting a plurality of chips to a chip carrier includes placing first chips on a transfer carrier, placing second chips on the transfer carrier, placing the transfer carrier with the first and second chips on the chip carrier and forming connections between the first chips and the chip carrier and the second chips and the chip carrier.

Batch process for connecting chips to a carrier

A semiconductor device and method is disclosed. One embodiment provides a method comprising placing a first semiconductor chip on a carrier. After placing the first semiconductor chip on the carrier, an electrically insulating layer is deposited on the carrier. A second semiconductor chip is placed on the electrically insulating layer.

Semiconductor device

A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.

Semiconductor device including isolation layer

A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer.

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

A method for making a device is disclosed. One embodiment provides a substrate having a first element protruding from the substrate. A semiconductor chip has a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. The semiconductor chip is placed over the first element of the substrate with the first surface of the semiconductor chip facing the substrate. The second electrode of the semiconductor chip is electrically coupled to the substrate, and the substrate is at least partially removed.

Method for making a device including placing a semiconductor chip on a substrate

A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.

Growing community of inventors

Maxhuette-Haidhof, Germany

Rupert Fischer