Qualcomm Incorporated

Rupal Prajapati

Peng Wang

Shujuan Wang

Terance Wijesinghe

An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus includes a vapor chamber coupled to a heat generating component of the electronic device. In an aspect, the vapor chamber is coupled to an inner surface of an outer cover of the electronic device and conforms to a shape of the inner surface of the outer cover. In another aspect, the vapor chamber forms the outer cover of the electronic device. The vapor chamber comprises a sealed container, a wick structure disposed on an inner surface of the sealed container, and a fluid contained in the sealed container, wherein as heat is applied to an evaporator side of the sealed container coupled to the heat generating component, the fluid vaporizes over a condenser side of the sealed container opposite the evaporator side and returns to the evaporator side via the wick structure.

Systems and methods for cooling an electronic device

Methods and systems for improved thermal management of a portable computing device ('PCD') with skin temperature sensors are disclosed. In an exemplary embodiment, a plurality of skin sensors are provided in the PCD, the plurality of skin sensors disposed on a flexible printed circuit board ('Flex PCB') located internal to the PCD proximal to an outer surface of the PCD. It is determined whether to obtain temperature information from one or more of the plurality of skin sensors, and one or more skin sensors from which to obtain temperature information are identified. The temperature information is obtained from the identified one or more skin sensors, and the temperature information is applied to a thermal mitigation policy.

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San Diego, CA, United States of America

Rupal Prajapati