Huawei Technologies Co., Limited

Huawei Digital Power Technologies Co., Ltd.

Ruoyang Du

Wei Wu

Yang Zhao

Yue Chen

Tao He

Zhen Lv

Yankun Xu

Yuanjun Sun

The disclosure discloses a motor driving method, an apparatus, and a system, and relate to the chip field. The solution may include: When a motor control apparatus determines that a motor needs to rotate at a maximum torque, the motor control apparatus controls a driver to output a first current to drive the motor to rotate. The first current is greater than a rated peak current of the driver and is less than or equal to a maximum load current of the driver. This method can resolve a problem that a waste of costs is caused because a through-current capability improved by a redundancy design of a switching transistor of a motor driver cannot be fully utilized for most customers and application scenarios.

Motor driving method, apparatus, and system

This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

Power device, power device assembly, and related apparatus

Growing community of inventors

Shenzhen, China

Ruoyang Du