Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Rung-An Chen

Ching-Bai Hwang

Nien-Tien Cheng

Yung-Fa Cheng

Zhi-Hui Zhao

Chin-Hsien Chen

Chien-Yu Chao

Cheng-Jen Liang

An exemplary electronic assembly includes a heat spreader, a socket, and an electronic component received in the socket. The electronic component includes a substrate and a chip disposed at a center of the substrate. The chip contacts a bottom surface of the heat spreader. The electronic assembly further includes a pair of flexible fixtures. One end of each flexible fixture abuts against the heat spreader, and another end of each flexible fixture abuts against either the substrate or the socket.

Electronic assembly with flexible fixtures for spreading load

An electronic device includes a circuit board, a heat generating component positioned on the circuit board, a casing receiving the circuit board and the heat generating component, and a working medium. The working medium is contained in the casing and covers the heat generating component. The working medium is electrically insulated and phase-change material, and represents solid state at normal temperature.

Electronic device

A phase change type heat dissipating device for dissipating heat from a heat generating component includes a casing, a working medium received in the casing and a heat pipe connected to the casing. The heat pipe includes an evaporator section and a condenser section. The working medium is electrically insulated and phase change material, and represents solid state at normal temperature. The heat generating component is received in the casing, and the evaporator section of the heat pipe extends into the casing and contacts the working medium.

Phase change type heat dissipating device

A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.

Portable electronic device and thermal module thereof

An exemplary electronic apparatus includes a casing, and an electronic component and a heat dissipation device received in the casing. The casing includes a bottom plate and an opposite top plate. The heat dissipation device includes a centrifugal fan defining an air outlet for airflow out, a heat sink arranged at the air outlet, and a heat pipe. A height of the heat sink along a direction parallel to a rotation axis of the centrifugal fan is less than that of the air outlet. The heat pipe includes an evaporation section thermally attached to the electronic component and a condensation section thermally attached to the heat sink.

Electronic apparatus with heat dissipation device

A centrifugal fan includes an impeller and a housing receiving the impeller therein. The impeller includes a hub and blades extending radially from the hub. The housing includes a bottom wall, a sidewall extending upwardly from the bottom wall and a bracket for supporting the impeller thereon. The bottom wall defines an air inlet therein. A plurality of protruding posts extend downwardly from a bottom surface of the bottom wall around the air inlet. Each of the protruding posts defines a screw hole therein. The bracket is located in the air inlet. The bracket defines a plurality of through holes corresponding to the protruding posts respectively. The protruding posts of the bottom wall are respectively inserted into the through holes of the bracket. A plurality of bolts are respectively screwed into the screw holes of the protruding posts to connect the bracket and the bottom wall together.

Centrifugal fan

An electronic apparatus includes a circuit board, a first and a second electronic components installed on the circuit board, and a heat dissipation device. The heat dissipation device includes a centrifugal fan defining a first air outlet and a second air outlet, a first fin assembly disposed at the first outlet of the centrifugal fan, a second fin assembly disposed at the second outlet of the centrifugal fan and thermally contacting the second electronic component, and a heat pipe. The heat pipe includes an evaporating section, a first condensing section and a second condensing section located at two ends of the evaporating section. The evaporating section thermally contacts the first electronic component. The first condensing section is thermally attached to the second fin assembly, and the second condensing section is thermally attached to the first fin assembly.

Heat dissipation device for electronic apparatus

A heat dissipation device includes a heat sink having a first fin unit and a second fin unit adjoining each other. The first fin unit includes a plurality of parallel stacked first fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The second fin unit includes a plurality of parallel stacked second fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The first fin unit and the second fin unit are arranged back-to-back. The main body of an outmost first fin adjacent to the second fin unit abuts the main body of an outmost second fin adjacent to the first fin unit. An interval between two neighboring first fins is smaller than that between two neighboring second fins.

Heat dissipation device

A thermal module includes a heat sink (), a heat pipe () and a fastening device (). The heat pipe has a condenser section () connected with the heat sink. The fastening device includes a base member () for fixing an evaporator section of the heat pipe, a positioning pole () disposed on and connected to the base member, and an elastic member (). The positioning pole includes a neck () and a head (). The elastic member includes an abutting portion () defining therein a positioning hole (), and two locking portions () extending from the abutting portion. The neck of the positioning pole is freely and loosely received in the positioning hole of the abutting portion. A maximal outer diameter of the head of the positioning pole exceeds a diameter of the fixing hole.

Fastening device for thermal module

A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

Notebook computer having heat pipe

A heat dissipation apparatus () includes a heat spreader (), and first and second resilient plates () provided at two opposite sides of the heat spreader. The first resilient plate includes a mounting arm () and two fixing arms () extending from two opposite ends of the mounting arm, respectively. The mounting arm defines a first mounting hole () therein, and each of the fixing arms defines a first fixing hole () therein. The second resilient plate defines a second mounting hole () and two second fixing holes () therein. The first resilient plate is fixed on the heat spreader via the first fixing holes. The second resilient plate is fixed on the heat spreader via the second fixing holes. The heat spreader is fixed on a circuit board via the first and the second mounting holes.

Heat dissipation apparatus

A notebook computer () includes a base (), a cover (), a computer printed circuit board (PCB) () and a centrifugal fan (). The cover covers the base, and cooperates with the base to form a receiving space () therebetween. The computer PCB is received in the receiving space and mounted on the base. The centrifugal fan is received in the receiving space, and includes a stator () and an impeller (), rotatable with respect to the stator. The stator includes a motor () and a fan PCB () directly attached to the base. The motor electrically connects to the fan PCB. When the impeller rotates, airflow enters the receiving space through top and bottom air inlets (). The fan PCB is integrally formed with the computer PCB and has a height less than the computer PCB.

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Taipei Hsien, Taiwan

Rung-An Chen