University of California

California Institute of Technology

Nxp Usa, Inc.

Marvell Asia Pte., Ltd.

Rulin Huang

Randy Tsang

Sai-Wang Tam

Alden C Wong

Su Chenxin

Sudhir Srinivasa

Rui Cao

Timothy J Donovan

Mau-Chung Frank Chang

Vijay Ahirwar

Adrian Tang

Alireza Razzaghi

We have demonstrated that the bandwidth millimeter wavelengths offer can be leveraged to deeply spread a low-data rate signal below the thermal floor of the environment (sub-thermal) by lowered transmit power combined with free space losses, while still being successfully received through a novel dispreading structure which does not rely on pre-detection to extract timing information. The demonstrated data link ensures that it cannot be detected beyond a designed range from the transmitter, while still providing reliable communication. A demonstration chipset of this sub-thermal concept was implemented in a 28 nm CMOS technology and when combined with an InP receiver was shown to decode signals up to 30 dB below the thermal noise floor by spreading a 9600 bps signal over 1 GHz of RF bandwidth from 93 to 94 GHz using a 64 bit spreading code. The transmitter for this chipset consumed 62 mW while the receiver consumed 281 mw.

Sub-thermal spread spectrum data-link

A millimeter-wave communication system includes a transmitter and a receiver. The transmitter is configured to be connected to a waveguide that is transmissive at millimeter-wave frequencies, the waveguide having a propagation parameter that varies with frequency at the millimeter-wave frequencies. The transmitter is configured to generate a millimeter-wave signal comprising multiple sub-carriers that are modulated with data, wherein each sub-carrier is modulated with a respective portion of the data and is subjected to only a respective fraction of a variation in the propagation parameter, and to transmit the millimeter-wave signal into a first end of the waveguide. The receiver is configured to receive the millimeter-wave signal from a second end of the waveguide, and to extract the data from the multiple sub-carriers.

Dispersion compensation in mm-wave communication over plastic waveguide using OFDM

A millimeter-wave communication device includes a coupler, Radio-Frequency (RF) circuitry and a composite right/left-handed metamaterial assembly. The coupler is configured to connect to a waveguide, the waveguide being transmissive at millimeter-wave frequencies and having a given dispersion characteristic over a predefined band of the millimeter-wave frequencies. The RF circuitry is configured to transmit a millimeter-wave signal into the waveguide via the coupler, or to receive a millimeter-wave signal from the waveguide via the coupler, and to process the millimeter-wave signal. The composite right/left-handed metamaterial assembly is formed to apply to the millimeter-wave signal, or to an Intermediate-Frequency (IF) signal corresponding to the millimeter-wave signal, a dispersion compensation that compensates for at least part of the dispersion characteristic of the waveguide over the predefined band.

Dispersion compensation in mm-wave communication over plastic waveguide using composite right/left-handed metamaterial assembly

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Los Angeles, CA, United States of America

Rulin Huang