Western Digital Technologies, Inc.

Shanghai Fusion Tech Co., Ltd.

Rui Yuan

Hope Chiu

Zengyu Zhou

Huan Liu

Jianzhe Li

Hua Feng

Jinjing Zhang

Wangping Long

Zhongwei Yu

Xi Cao

Paul Qu

Yi Su

Shixing Zhu

Xiaoyu Wu

Kevin Du

Jiandi Du

Fen Yu

Vincent Jiang

Xinpeng Fan

Alex Zhang

Xingpeng Fan

A memory device includes a substrate, a controller die, a flip chip die, first and second silicon dies, and bond wires. The controller and flip chip dies are attached to the substrate using connection balls and in electrical communication with each other. The first and second silicon dies include respective first and second contact pad surfaces. The bond wires electrically connect the contact pad surfaces to the substrate so the first and second silicon dies communicate with the controller die. The flip chip die and first and second silicon dies are NAND dies, the flip chip die is configured as SLC memory, and the silicon dies are configured as one of MLC memory, TLC memory, or QLC memory.

Packaged memory device with flip chip and wire bond dies

A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.

Reducing keep-out-zone area for a semiconductor device

A method and apparatus for substrate component layout and bonding for increased package capacity. According to certain embodiments, a wire-bonding finger strip is disposed between a flip-chip die and a NAND die stack to reduce a keep out zone (KOZ) required for an underfill material dispensed beneath the flip-chip die. To further inhibit the flow of the underfill material and further reduce the KOZ, a solder mask may be placed adjacent to the flip-chip. According to certain embodiments, there may be at least three sides of the flip-chip that may have such an adjacent solder mask placement. The three sides of the flip-chip according to such embodiments may be those non-adjacent to the wire-bonding finger strip.

Substrate component layout and bonding method for increased package capacity

Some embodiments of the disclosure provide a flatness detection device. In an embodiment, the flatness detection device includes a back plate, an electromagnet, a cross beam, a probe, and a limiting frame. The limiting frame and the electromagnet are provided side by side on the back plate. The cross beam is located above the limiting frame and the electromagnet. The probe vertically penetrates the cross beam and the limiting frame. A spring is provided between the cross beam and the electromagnet. The spring is movable in a vertical direction by a guide, the movement being at least one of compression and extension.

Flatness detection device

A method for adjusting height of a 3d printer nozzle. In an embodiment, the method uses a fully wavy line as a reference line. The method includes the following steps. Determining an initial value of a height difference between the nozzle and a bottom of a probe by using a feeler gauge. Moving the nozzle vertically to adjust the height based on the initial value, obtaining a printing height of a first line, and printing the first line. Determining whether the first line is a fully wavy line. Adjusting the height of the nozzle for N times according to a preset step value, and printing N lines with corresponding heights. Determining whether the N lines have a fully wavy line. Calculating the height difference between the nozzle and the bottom of the probe by an equation. Adjusting the height of the nozzle.

Methods for adjusting height of a 3D printer nozzle

Growing community of inventors

Shanghai, China

Rui Yuan