Asahi Glass Company, Limited

Rui Yanagawa

Hideaki Hayashi

Kenji Imakita

Yasuko Osaki

Katsuyoshi Nakayama

Akihiro Hishinuma

Shinji Honda

Kazuyoshi Orihara

Takashi Ootsuki

To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO, from 13 to 18% of BO, from 9 to 23% of CaO, from 3 to 8% of AlOand from 0.5 to 6% of at least one of KO and NaO in total, and a ceramic filler.

Light emitting diode package

Growing community of inventors

Koriyama, Japan

Rui Yanagawa