Murata Manufacturing Co., Ltd.

Rui Tanaka

Yukiya Yamaguchi

Morio Takeuchi

Atsushi Horita

Shigeru Tsuchida

Tomoaki Sato

In a high-frequency module, a plurality of signal paths of a switch circuit include a plurality of switching elements that switch a connection form between a plurality of common terminals and a plurality of selection terminals. At least one signal path among the plurality of signal paths of the switch circuit includes a first wiring pattern portion included in the IC chip, and a second wiring pattern portion included in a mounting board.

High-frequency module and communication device

A radio-frequency module includes a mounting substrate, a first filter, a second filter, a shield layer, and a conductor. The mounting substrate has a first main surface and a second main surface on opposite sides. The shield layer is disposed on an outer surface of a resin layer with which the first filter and the second filter are covered. The radio-frequency module is capable of performing simultaneous transmission by using both the first filter and the second filter. The conductor is disposed on the first main surface of the mounting substrate and is in contact with the transmitting filter and the mounting substrate. The conductor is in contact with the shield layer on a side other than a side closer to the second filter than to the first filter.

Radio-frequency module and communication device

A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.

A radio-frequency module is able to simultaneously communicate a signal of a first communication band and a signal of a second communication band and does not simultaneously communicate a signal of the first communication band and a signal of a third communication band. The radio-frequency module includes a mounting substrate, a filter, a filter, and a filter. The filter is provided on the mounting substrate and has the first communication band as the pass band thereof. The filter is provided on the mounting substrate and has the second communication band as the pass band thereof. The filter is provided on the mounting substrate and has the third communication band as the pass band thereof. The filter and the filter are indirectly stacked on top of each other and the filter and the filter are not stacked on top of each other.

A radio frequency module includes: a module board including a first principal surface; a reception filter disposed on or above the first principal surface; a transmission filter disposed on the reception filter; a switch mounted on the module board; and a bonding wire that connects the transmission filter to the switch. One end of the bonding wire is connected to the transmission filter and the other end of the bonding wire is connected to the switch.

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Nagaokakyo, Japan

Rui Tanaka