Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Rui-Hua Chen

Xue-Wen Peng

Hsieh-Kun Lee

Bing Chen

Jun-Hai Li

A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.

Heat dissipation device for computer add-on cards

A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Heat dissipation device

A heat dissipation device includes a base (), a heat radiator () mounted on the base (), and two heat pipes () connecting the base () and the heat radiator (). The base () has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes () each comprise an evaporating portion () embedded in the base () and a condensing portion () extending from an end of the evaporating portion (). The heat radiator () comprises first and second fin assemblies () each having two contacting faces (), the condensing portions () of the heat pipes () are sandwiched between the contacting faces () by the first and second fin assemblies (), and an opening is enclosed by the first and second fin assemblies () and receives an electric fan () therein.

Heat dissipation device with a heat pipe

A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.

A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to the heat sink and a securing portion for being fixed to a panel of the computer enclosure and a mounting plate of the add-on card. The fixing bracket is configured to rest a part of weight of the heat sink on the computer enclosure.

Heat dissipation device having fixing bracket

A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion.

A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and oriented parallel to each other, and form a plurality of air passages therebetween. The axial fan is installed at a lateral side of the fin set and directs airflow into the fin set through the air passages. The fin set has an inclined area at an end thereof, and the fan is installed on the inclined area of the fin set and oblique to the base.

Heat dissipation apparatus for heat producing device

A VGA card assembly includes a VGA card () having a heat-generating electronic component () mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director () defining a receiving room () therein. A thermal module () is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover () is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.

Video graphics array (VGA) card assembly

A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes four pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.

Heat dissipating apparatus for computer add-on cards

A VGA card assembly comprises a VGA card () having a socket () thereon. A GPU () is attached on the socket. A base plate () is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back plate () is located below the VGA card, for supporting the VGA card. The back plate has studs extend upwardly through the VGA card. Fasteners extend downwardly through the socket to threadedly engage with the studs. Screws extend downwardly through the base plate to threadedly engage with the fasteners. A heat dissipation device including a fan, a heat pipe, fins and a lid is removably mounted on the base plate.

A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.

A heat dissipating device mounted onto a VGA card () includes a base () contacting with a GPU () attached on the VGA card, a cover () mounted on the base, and a plurality of fins () received between and thermally connecting the cover and the base. The base defines a slot () above the GPU. A fan () is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.

Heat dissipating device for computer add-on cards

A heat dissipation device for being installed to and cooling an electronic card device () includes first and second heat dissipation units () and at least one heat pipe (). The heat dissipation units each include a base plate () and a fin plate () engaged with the base plate. The at least one heat pipe includes an evaporating segment () received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment () received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together. The evaporating segment and the condensing segment of the at least one heat pipe are movably received in the first and second heat dissipation units respectively before the heat dissipation device is installed to the electronic card device and dissipating heat generated therefrom, and are firmly secured in the first and second heat dissipation units respectively after the heat dissipation device is installed to the electronic card device and dissipate heat generated therefrom.

A heat dissipation device includes a first heat sink () mounted on one side of a video graphics adapter (VGA) card () on which a heat generating componnent () is mounted to dissipate heat generated by the heat generating componnent, a second heat sink () mounted on an opposite side of the card, a first heat pipe (') thermally connected to the first heat sink, a second heat pipe (&#x2032;) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (&#x2032;) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

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Shenzhen, China

Rui-Hua Chen