Boe Technology Group Co., Ltd.

Rui Hong

Dan Wang

Song Zhang

Tao Wang

Seiji Fujino

Chengjie Qin

Lingzhi Qian

Xinwei Gao

Penghao Gu

Chao Kong

Lei Chen

Can Zhang

Tao Sun

Chunyan Xie

Wei Cui

Ziyu Zhang

Youwei Wang

Zhengyin Xu

Xiaohu Wang

Provided in the present disclosure are a display substrate, a preparation method therefor, and a display apparatus. The display substrate includes a substrate, a light-emitting structure layer disposed on the substrate, and a encapsulation structure layer disposed on the light-emitting structure layer; the encapsulation structure layer includes a encapsulation layer and at least one transition layer; a side of a transition layer adjacent to the substrate makes contact with a first side film layer, and a side of a transition layer away from the substrate makes contact with a second side film layer; the adhesion of the at least one transition layers is greater than that of one film layer among the first side film layer and the second side film layer, and less than that of the other film layer among the first side film layer and the second side film layer.

Display substrate, preparation method therefor, and display apparatus

Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a display area, a mounting hole located in the display area, and an encapsulation region located between the display area and the mounting hole. The encapsulation region includes an insulating layer, an encapsulation pixel definition layer arranged on the insulating layer, and a partition structure layer arranged on the encapsulation pixel definition layer. The encapsulation pixel definition layer includes multiple spaced protrusions, the partition structure layer includes multiple spaced columns, the columns are arranged on the protrusions, a functional layer is arranged on the multiple spaced columns, and the functional layer is broken by the columns.

Display substrate and preparation method thereof, and display apparatus

An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.

Encapsulation structure, electronic apparatus and encapsulation method

Embodiments of the present disclosure provide a thin film encapsulation structure and a method for manufacturing the same. The thin film encapsulation structure includes a laminated layer for encapsulating a member to be encapsulated located on a substrate, the laminated layer including an organic layer and an inorganic layer alternately stacked, wherein an outermost layer of the laminated layer is the inorganic layer, the organic layer having an inner surface facing the member, an outer surface opposite to the inner surface, and an end surface located between the inner and outer surface and extending over a region, at a periphery of the member, of the substrate, a restriction layer, for positioning the organic layer, located between the end surface of the organic layer and a surface of the substrate, wherein the organic layer has one of hydrophilicity and hydrophobicity and the restriction layer has the other of hydrophilicity and hydrophobicity.

Thin film encapsulation structure and method for manufacturing the same

A display panel is provided which comprises a substrate, a backboard, and an electroluminescent device layer, which are stacked in sequence, the electroluminescent device layer having a hole at a display region of the display panel, a laser protection layer is provided on a periphery of the hole of the electroluminescent device layer.

Display panel, hole forming method, and electronic equipment

An encapsulation structure of an organic electroluminescent device includes a substrate, a first inorganic sealing layer and an organic sealing layer. The first inorganic sealing layer is stacked on the substrate, and the organic sealing layer is stacked on a side of the first inorganic sealing layer that is away from the substrate. The organic sealing layer includes a UV light absorbing material and/or a UV resistant polymer material. An encapsulation method of the encapsulation structure of an organic electroluminescent device and a display panel including the encapsulation structure are further provided.

Encapsulation structure and encapsulation method of electroluminescent device, display panel

A display panel. The display panel includes a base substrate; a plurality of light emitting elements on the base substrate; and an encapsulating structure encapsulating the plurality of light emitting elements. The encapsulating structure includes a first inorganic encapsulating sublayer; a first organic encapsulating sublayer; and a first amphiphilic cross-linking sublayer between the first inorganic encapsulating sublayer and the first organic encapsulating sublayer.

Display panel, display apparatus, method of fabricating display panel, and encapsulating structure

The present disclosure provides a packaging structure of the OLED device and an OLED device. The packaging structure of the OLED device encapsulates an OLED light-emitting structure of the OLED. The packaging structure includes an inorganic barrier layer, an organic sealing layer and a sacrificial protective layer. The organic sealing layer is laminated with the inorganic barrier layer. The sacrificial protective layer is disposed on one side of the organic sealing layer far away from the OLED light-emitting structure, and the sacrificial protective layer is in close contact with the side of the organic sealing layer.

Packaging structure of OLED device and OLED device

A laser packaging method and a manufacturing method of a display panel are provided. The laser packaging method includes placing a first substrate () on a platform (), and arranging a glass frit in a packaging region of the first substrate (); cell-assembling a second substrate () and the first substrate (); and pre-heating the first substrate () and the second substrate () which are cell-assembled.

Laser packaging method and manufacturing method of display panel

Examples of the present invention provide a frit material, a photoelectric packaged device and a packaging method thereof, and a display apparatus. They relates to the field of display technology, and may reduce the bubbles generated during the sintering of the frit material at high temperature, improve the flatness of the surface of the frit material, and increase the proportion of the packaged area after the frit material is adhered to the device substrate, to increase the mechanical strength of the packaged OLED panel, while the viscosity of the frit material is not affected. The frit material comprises frit-powders and an organic material comprising an organic thickener, wherein the frit material further comprises an inorganic thickener consisting of a clay mineral material. Examples of the present invention are used for production of the frit material, the photoelectric packaged device comprising the frit material, and the display apparatus.

Frit material, photoelectric packaged device and packaging method thereof, and display apparatus

The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.

Glass powder blend, glass powder paste and photoelectric package

A packaging method, a display panel, and a display apparatus. The packaging method comprises steps of: forming a frit layer in a packaging area of a first substrate; forming at least a metal thin film and/or at least a silicon thin film on the frit layer formed on the first substrate, and forming at least a metal thin film and/or at least a silicon thin film in a packaging area of a second substrate, wherein one of the outermost thin film formed on the frit layer and the outermost thin film formed is a metal thin film, and the other is a silicon thin film; and vacuum laminating the first substrate and the second substrate, without the use of a laser to irradiate the frit layer during the packaging.

Packaging method, display panel and display apparatus

Embodiments of the present disclosure disclose an encapsulation structure, an encapsulating method and a display device. The encapsulation structure includes a first substrate and a second substrate arranged opposite to each other, and a sealing structure provided between the first substrate and the second substrate. Wherein the sealing structure is provided with one or more voids, and a filler is provided within the one or more voids and includes a gas-absorbing material.

Encapsulation structure, encapsulating method and display device

A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Composition for packaging electronic device, packaging method, and OLED display apparatus

The present invention discloses a packaging device and a packaging method and relates to a field of manufacturing technique of a display panel. The packaging device is used to package a display panel, the display panel comprising a first substrate and a second substrate that are arranged opposed to each other and are able to be packaged by a sealing material, the packaging device comprising a first adsorption part and a second adsorption part that are able to attract each other through a magnetic force, one of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the first substrate, and the other of the first adsorption part and the second adsorption part configured to be detachably arranged on the outside of the second substrate.

Growing community of inventors

Beijing, China

Rui Hong