Siliconware Precision Industries Co., Ltd.

Rui-Feng Tai

Chang-Fu Lin

Chee-Key Chung

Yuan-Hung Hsu

Don-Son Jiang

Hsi-Chang Hsu

Chi-Jen Chen

Kong-Toon Ng

Bo-Hao Ma

Chen-Yu Huang

Chih-Hsun Hsu

An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

Electronic package and fabrication method thereof

An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Method for fabricating electronic package

Electronic package

Growing community of inventors

Taichung, Taiwan

Rui-Feng Tai