Hewlett-packard Development Company, L.P.

Ruhua Cai

Sterling Chaffins

Kristopher J Erickson

Kevin P Dekam

Cory J Ruud

Jami Ryan Barone

Anthony J Galvan

In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.

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Corvallis, OR, United States of America

Ruhua Cai