Taiwan Semiconductor Manufacturing Comp. Ltd.

Ruei-Hung Jang

Chih-Lin Ying

Tien-Hsing Woo

Tsung-Chi Hsieh

Ming-Kuo Yu

Sheng-Liang Pan

Shih-Shiung Chen

Chin-Hsiang Lin

Tsai-Sheng Gau

Tai-I Yang

Chyi-Tsong Ni

Chih-Hao Lin

Hong-Seng Shue

Tzu-Yang Wu

Ya-Wen Lee

Chun-Yi Yang

Wen-Hung Tseng

Tsui-Ling Yen

Shan-Hua Wu

Chun-Li Fang

Ching-Hui Tai

Bpin Lo

Marcus Yang

Cheng-Ming Chiu

Chun-Yan Chen

The present disclosure relates to a semiconductor device. A fuse layer is arranged within a first dielectric layer. A bond pad is arranged on the first dielectric layer. A second dielectric layer is arranged along sidewall and upper surfaces of the bond pad. A passivation layer is arranged over the first and second dielectric layers, and the passivation layer having a bond pad opening overlying the bond pad and a fuse opening overlying the fuse layer. The bond pad has a bottom surface that is co-planar with a bottom surface of the passivation layer.

Method for forming fuse pad and bond pad of integrated circuit

The present disclosure relates to a method of forming a deep trench capacitor. In some embodiments, the method may be performed by selectively etching a substrate to form a trench having serrated sidewalls defining a plurality of curved depressions. A dielectric material is formed within the trench. The dielectric material conformally lines the serrated sidewalls. A conductive material is deposited within the trench and is separated from the substrate by the dielectric material. The dielectric material is configured to act as a capacitor dielectric between a first electrode comprising the conductive material and a second electrode arranged within the substrate.

Deep trench capacitor with scallop profile

The present disclosure relates to a method of fabricating a semiconductor device. A semiconductor device includes a bond pad and a fuse layer. The bond pad includes a coating on an upper surface. A dielectric layer is formed over the bond pad and the fuse layer. A passivation layer is formed over the dielectric layer. An etch is performed to form a bond pad opening and a fuse opening. The etch is performed using only a single mask. The fuse opening defines a fuse window. The upper surface of the bond pad is exposed by substantially removing the coating from the entire upper surface.

Embodiments of an image-sensor device structure and a method of manufacturing thereof are provided. The image-sensor device structure includes a semiconductor substrate and a light-sensing region in the semiconductor substrate. The image-sensor device structure also includes an interconnect structure over the semiconductor substrate, and the interconnect structure includes a transparent dielectric layer over the light-sensing region. The transparent dielectric layer has an optical transmittance ranging from about 90% to about 97%.

Image-sensor device structure and method of manufacturing

Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.

Method and system for patterning alignment marks on a transparent substrate

A self-contained ventilator includes a housing having a support member for supporting a pollution source. A filter is further disposed in the housing for filtering contaminants emitted from the pollution source. A conduit is adapted to connect to the housing to provide non-housing communication between portions of the housing. A fan is situated in the conduit to generate an airflow that follows a path through the housing, through the conduit, and back to the housing. The airflow entrains the contaminants such that the contaminants are captured by the filter upon passage of the airflow through the filter.

Method and apparatus for filtering contaminants

A method and apparatus for measuring the vacuum gripping strength of a vacuum wand or robotic arm provides a pressure gauge and a conduit extending from the pressure gauge and terminating at an opening formed in a receiving surface. A vacuum wand head is positioned on the receiving surface such that the gripping surface of the vacuum wand forms a conterminous boundary with the receiving surface and the vacuum port of the vacuum wand is aligned over the opening formed in the receiving surface. The receiving surface replicates a wafer surface so that the same vacuum gripping strength as would be delivered to a wafer being gripped by the vacuum wand, is thereby sensed by the pressure gauge. Spring loaded positioning members act in conjunction with a clamp member and a mechanical stop position the vacuum wand head in the receiving area and over the opening and also to assure that the gripping surface of the vacuum wand head is flush against the surface of the receiving area. Diminution of vacuum gripping strength caused by scratches or other defects of the gripping surface that cause vacuum leaks between gripping surface and the wafer surface, are similarly reproduced and sensed by the pressure gauge.

Method and apparatus for measuring gripping strength of a vacuum wand

A wet etch system including a process tank having an inner etch bath chamber and an outer overflow chamber surrounding the etch bath chamber. A frame which is removably mounted on the process tank defines a diversion channel between the upper ends of the etch bath chamber and overflow chamber. The etch bath chamber receives a wafer-containing cassette, which displaces etchant from the etch bath chamber, through the diversion channel and into the overflow chamber, where the etchant is drained from the process tank. Particulate impurities leave the etch bath chamber, enter the overflow chamber and drain from the process tank with the overflow etchant. Fresh etchant is poured into the etch bath chamber prior to a subsequent etch cycle. A water spray loop may be provided in the overflow chamber for removing etch particles from the interior wall surfaces of the overflow chamber.

Wet etch system with overflow particle removing feature

An in-line fluid heater including a heater housing that contains a parabolic lamp vessel which houses an infrared lamp. A parabolic reflection vessel in the heater housing is separated from the parabolic lamp vessel by a convex lens. A quartz plate seals the heater housing, and at least one, and typically, multiple leak detectors may be provided in the heater housing. The interior reflective surface of the reflection vessel reflects the heat energy in parallel rays through the quartz plate and to the fluid to be heated. The leak detectors may be connected to an RC circuit which operates a controller to actuate a buzzer or alarm and terminate operation of the heater upon leakage of fluid into the heater housing.

In-line fluid heater

A method and apparatus for carrying out a method for thermophoretically removing particles from a particulate containing liquid the method including providing a heated turbulent flowing particulate contain liquid through a first conduit; redirecting a portion of the particulate containing liquid through a second conduit to provide laminar flow having a flow direction substantially parallel to the first conduit; forming a thermal gradient in said second conduit substantially perpendicular to the flow direction; concentrating particles in the particulate containing liquid in a portion of the second conduit aided at least in part by thermophoretic forces; and, separating the particulate containing liquid into at least a relatively concentrated particle containing portion and a relatively unconcentrated particle containing portion.

Thermophoretic particle removing system

A static mixer comprises a mixing chamber with an inlet mixing module, fluids to be mixed being fed into the module to undergo swirling and jet collision, at least one intermediate mixing module connected to the inlet mixing module and provided with means for splitting liquid flow into a plurality of jet flows with subsequent recombination of said jets and mixing action of vortices formed around the jet flows, and an outlet mixing module connected to the intermediate mixing module and provided with means for further swirling premixed fluids.

Fluid mixing apparatus

Fluid leak detection through thermal sensing is disclosed. A sensor includes one or more flexible, thermally conductive, fluid isolating layers, and a thermally sensitive detector situated within the flexible, thermally conductive, fluid isolating layers. The detector is responsive to a temperature change resulting from leaking fluid coming in contact with the sensor. The sensor may also including an affixing mechanism, such as glue, on the isolating layers, to affix the sensor to a potential fluid leak source, such as a tank or a piping line. The sensor may further include connectors located at its ends. The detector may be a thermally sensitive resistor, such as platinum or nickel, and the, fluid isolating layers may be capton.

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Shinjuang, Taiwan

Ruei-Hung Jang