Leica Microsystems Wetzlar Gmbh

Ruediger Stenzel

Albrecht Weiss

Michael Ganser

The invention relates to a device for laser cutting preparations which comprises an XY table () that defines a table surface (). A holding device () for accommodating an object support () with a preparation () is arranged above the table surface () and is joined to the XY table () in a manner that permits it to be displaced in the Y direction () in the X direction (). An open working space () is defined between the holding device () and the table surface (). A catching device (), which has at least one receptacle () for catching a preparation part that has been cut out, can be introduced into said working space. The invention also relates to a microscope that is equipped with the aforementioned laser cutting device.

Device for laser cutting preparations, and a microscope

A microscope having a stand ( ) and having a revolving nosepiece ( ) rotatably articulated on the stand ( ), the revolving nosepiece ( ) having at least two receptacles ( ) for one objective ( ) each, and an objective ( ) being deliverable into a beam path ( ) of the microscope by the rotation of the revolving nosepiece ( ), is configured, in the interest of easy association between an objective ( ) and its position in the beam path ( ) of the microscope, in such a way that one transponder ( ) each is associated with the objective ( ) or objectives ( ), and a reading device ( ) for communication with the transponder ( ) is associated with the stand ( ).

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Hilchenbach, Germany

Ruediger Stenzel