Micronas Intermetall Gmbh

Ruediger Joachim Stroh

Gunter Igel

Bozenka Schweinoch

Uwe Thomas

Erich Allmann

Martin Trefzer

Craig Coad

An apparatus for dry-leaning dust-contaminated auxiliary objects for handling and storing semiconductor wafers is disclosed and comprises a housing having a receiving opening and a closable lid for closing the opening. The housing further includes a receiving space for receiving an auxiliary object and a collecting space spatially separated therefrom, gas inlet nozzles having corresponding gas outlet openings in the receiving space for injecting a cleaning gas into the receiving space, and a gas draw-off opening in the collecting space for receiving the injected cleaning gas flowing from the receiving space to the collecting space. As the injected cleaning gas flows over the auxiliary object from the receiving space to the collecting space, the dust particles are removed from the auxiliary object by the flow of injected cleaning gas over the auxiliary object and delivered to said gas draw-off opening for disposal.

Apparatus for dry-cleaning dust-contaminated auxiliary objects for

A process for manufacturing discrete electronic devices with active structures in an SOI (silicon-on-insulator) substrate which is thickened by an epitaxial layer and whose surface has a &lt;100&gt; orientation, said process comprising the steps of: anisotropically etching the first silicon layer to form a moat having a diameter tapering in the direction of the insulator layer, said moat extending to the insulator layer; forming an insulating layer on the sidewalls of the moat; removing a portion of the insulator layer adjoining the moat to expose a portion of the second silicon layer, which is separated from the first silicon layer by the insulator layer; forming the active structure in the second silicon layer below the portion of the insulator layer which was removed; and depositing a contact layer on the insulating layer and the active element for making contact to the active structure.

Process for manufacturing discrete electronic devices

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Freiburg, Germany

Ruediger Joachim Stroh