Henkel Kommanditgesellschaft Auf Aktien

Henkel Ag & Company, Kgaa

Ruediger Butterbach

Siegfried Kopannia

Ulrike Maassen

Judith Siepenkothen

Carsten Schubert

Marcus Heemann

Johannes Andres

Juergen Foell

Luca Mario Marchese

Fabio Angelo Spada

Patrick Markiefka

Ulricke Maassen

Dirk Bonke

Jean Louis Requin

Fabio Ticozzelli

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.

Thermally conductive adhesive

The invention discloses a hot melt composition comprising a block copolymer consisting of at least two blocks as reaction product of a polyamide having a molecular weight of 5000 g/mol to 100000 g/mol and a modified olefin copolymer having a molecular weight of 3000 to 100000 g/mol and containing covalently bound organic acid anhydride groups to the polymer chain, wherein the polyamide has an amine number from 0.2 to 10 and the olefin copolymer has an acid number from 1 to 100.

Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer

A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150&#xb0; C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190&#xb0; C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.

Reactive two-component hotmelt adhesive composition

Water-swellable hot-melt adhesives based on a tackifying resin, a water-dispersible EVA wax, an ethylene/acrylic ester copolymer, a water-soluble homo- or co-polymer and a super absorber polymer powder having an average particle size of less than 80 &mgr;m display a clearly improved swelling behavior in comparison with the prior art. Furthermore, the swelling agent is significantly more homogeneously distributed in the matrix. Such hot-melt adhesives are suitable for ensuring longitudinal water impermeability in modern cable structures, as water-swellable jointing compounds in the building industry in the area of building conservation and restoration. Such hot-melt adhesives are further suitable for the manufacture of absorbent textile fabrics in the personal hygiene sector.

Water-swellable hot-melt-type adhesive

The present invention relates to a process for preparing a digital versatile disc. The process of the present invention includes providing a hot melt adhesive containing at least one thermoplastic elastomer, at least one hydrocarbon resin, at least one poly-&agr;-olefin, and at least one polar wax, and providing at least two disc blanks. The hot melt adhesive is applied directly or indirectly to at least one of the blanks and the blanks are bonded together using the hot melt adhesive. The present invention also provides a digital versatile disc containing the hot melt adhesive.

Hot-melt adhesive for glueing DVDs

Thermoplastic compositions based on a water-insoluble component of one or more thermoplastic copolymers and one or more resins with a saponification number and a water-soluble or water-dispersible component and a water-swellable component from the class of superabsorbers are suitable as water-swellable hotmelt adhesives. Such water-swellable hotmelt adhesives are preferably used for the production of watertight constructions, more particularly for the production of longitudinally watertight cable constructions.

Swellable hotmelt adhesive

Hotmelt adhesives with a melt viscosity of >100,000 mPas at 160&deg; C. are suitable for bonding substrate halves in the production of digital versatile discs (DVDs) and afford major process-related advantages over known UV-curing adhesives. In their pigmented embodiment, they are able to combine the three functions of adhesive bonding, protecting the metallic reflection layer against corrosion and forming a covering background for a text/graphics layer.

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Essen, Germany

Ruediger Butterbach