Motorola Corporation

Motorola Mobility LLC

Rudy Michael Emrick

Steven James Franson

Bruce Bosco

John E Holmes

Stephen Kent Rockwell

Salvador Sibecas

Zili Li

Glafkos K Stratis

Celestino Anastasio Corral

Shahriar Emami

Ronald Dee Fuller

Roger L Scheer

Islamshah S Amlani

Wade Norman Understiller

Zhengfang Qian

Richard Dennis Heidinger

Nestor J Escalera

Antennas () or other radio frequency components that include an electrically configurable anisotropic element () are provided. According to certain embodiments the electrical configurable anisotropic element () includes a material () including carbon nanotubes or conductive nano-tubes or nano-wires () dispersed in a liquid crystal material or other medium with that can be aligned by an applied field.

Radio frequency system component with configurable anisotropic element

A one-dimensional nanostructure multi-port coupler () is provided for use in an RF device (). The coupler () includes a first plurality of one-dimensional nanostructures () aligned substantially in a first direction () and coupled between the input () and first output ('), and a second plurality of one-dimensional nanostructures () substantially aligned in a second direction (), coupled to a second output (), and disposed contiguous to the first plurality of one-dimensional nanostructures (). The first and second plurality of one-dimensional nanostructures () may comprise first and second contiguous planes. The amount of RF energy coupled may be controlled by varying the width, density, diameter, and type of one of the plurality of one-dimensional nanostructures () versus the other. The amount of RF energy coupled may also be controlled by varying the angle between the first and second plurality of one-dimensional nanostructures () and by disposing a dielectric material () therebetween.

RF system having a one-dimensional nanostructure multi-port coupler

A device () is provided for matching the CTE between substrates (), e.g., a semiconductor substrate and packaging material. The first substrate () has a first coefficient of thermal expansion and the second substrate () has a second coefficient of thermal expansion. At least two layers () of liquid crystal polymer are formed between the first substrate () and the second substrate (), each layer having a unique coefficient of thermal expansion progressively higher in magnitude from the first substrate () to the second substrate ().

Graded liquid crystal polymer package

An antenna system () includes an antenna structure (), a receiver (), and an antenna system controller (). The antenna structure includes an arrangement of antennas (), a signal combiner (), and a switching matrix (). The arrangement of antennas is designed to have a set of antenna element separations that are optimized to provide lowest correlation coefficients of intercepted radio signals for a corresponding set of electromagnetic environment types that vary from a very low density scattering environment to a maximum density scattering environment. The antennas (), (), (), (), () in the antenna arrangement each include at least one element that has a common polarization. There is at least one antenna that is a dual polarized antenna. The antenna system selects an antenna element pair that corresponds to the environment type which it is operating and thereby receives a best combined signal.

Adaptive diversity antenna system

A packaging structure () is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure () comprises first and second packaging layers () forming a cavity. Two liquid crystal polymer (LCP) layers () are formed between and hermetically seal the first and second packaging layers (). First and second conductive strips () are formed between the LCP layers () and extend into the cavity. An electronic device () is positioned within the cavity and is coupled to the first and second conductive strips ().

Hermetic cavity package

An improved transceiver assembly for a vehicle for detecting potentially hazardous objects is disclosed. The transceiver assembly preferably comprises a patch array feed antenna having an array of a plurality of patches for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that moves to sweeps the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna.

Patch array feed for an automotive radar antenna

In one embodiment, an improved transceiver assembly for a vehicle capable of detecting potentially hazardous objects is disclosed. The transceiver assembly comprises a tapered slot feed antenna for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that oscillates to sweep the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna. The antenna is preferably formed on a printed circuit board (PCB) (substrate), which can include additional circuitry necessary to operate the antenna, and which is preferably mounted at an acute angle with respect to the housing to direct the beam at the parabolic dish.

Tapered slot feed for an automotive radar antenna

According to the most preferred embodiments of the present invention, at least one of the two plates of a capacitor is formed in at least two different layers of an integrated circuit. The methods of the present invention uses 'air bridges' or some other dielectric medium to isolate certain portions of the two capacitive plates of a capacitor where at least a portion of one of the capacitive plates passes over at least a portion of the other capacitive plate. The line widths, line separation and number of levels used in the topology of the capacitor will determine the overall capacitance value of a given structure.

Monolithic bridge capacitor

According to the preferred exemplary embodiments of the present invention, a transmission line, such as microstrip, is connected to a waveguide using suspended stripline as an intermediate connection. This method results is a very low-loss transition, suitable for active microwave device applications such as low-noise receivers and transmitting devices such as power amplifiers.

Low loss waveguide launch

A semiconductor structure includes a monocrystalline silicon substrate, an amorphous oxide material overlying the monocrystalline silicon substrate, a monocrystalline perovskite oxide material overlying the amorphous oxide material, and a monocrystalline compound semiconductor material overlying the monocrystalline perovskite oxide material. A composite transistor includes a first transistor having first active regions formed in the monocrystalline silicon substrate, a second transistor having second active regions formed in the monocrystalline compound semiconductor material, and a mode control terminal for controlling the first transistor and the second transistor.

Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same

A monolithically integrable spiral balun comprises a substrate having first, second, third, and fourth transmission lines formed thereon. The first transmission line has a first end coupled to receive an input signal and has a second end. The first transmission line forms a spiral that winds in a first direction from its first end to its second end. The second transmission line has a first end and has a second end electrically coupled to the second end of the first transmission line. The second transmission line forms a second spiral that winds in a second direction from its first end to its second end. The third transmission line has a first end for providing a first output and a second end for coupling to a first potential. The third transmission line forms a third spiral that interleaves the first spiral and winds in the second direction from its first end to its second end. A fourth transmission line has a first end for providing a second output and a second end for coupling to a second potential. The fourth transmission line forms a fourth spiral that interleaves the second transmission line and winds in the first direction from its first end to its second end.

Spiral balun

High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Once such a structure is built, a high electron mobility transistor (HEMT) or a heterojunction bipolar transistor (HBT) can be constructed on the structure. A HEMT or HBT of the above structure can then be used in a switch or in an amplifier.

Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates

An integrated circuit for intermediate impedance matching and stabilization of high power devices is disclosed. High quality epitaxial layers of monocrystalline materials grown over monocrystalline substrates enables the formation of impedance matching and stability circuits to be placed on the same substrate as the active device. Additionally, by using the manifolds of the active to form plates of a capacitor, an impedance matching network of series inductance and shunt capacitor can be compactly fabricated for increasing the output impedance to intermediate levels. The manifolds of the active device are also used to form capacitors to provide stability to high power active devices.

Integrated impedance matching and stability network

A waveguide feed is fabricated by first creating a lead frame (10) from a piece of conductive material. The lead frame (10) is shaped by bending arms (22) and probe portions (18) on the lead frame (10) into a desired shape. The lead frame (10) is then placed in a mold and dielectric molding material is added around relevant portions of the lead frame (10). After the dielectric molding material has solidified, excess molding material and extraneous portions of the lead frame (10) are removed from the molded feed assembly. The assembly can then be connectorized and inserted into a waveguide.

Growing community of inventors

Gilbert, AZ, United States of America

Rudy Michael Emrick