International Business Machines Corporation

Rudolph Manuel Lopez

George G Zamora

Bruce Dale King

Alex Irwin Panasiuk

Richard Lee Carlson

Paul Y Hu

James Lamar Nix

Robert E Weinstein

A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the conductors. The multiconductor flat cable or electrical component comprises a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.

Direct thermal compression bonding through a multiconductor base layer

A bonding opening exposing conductors through a cover of a multiconductor flat cable or electrical component to allow direct bonding thereof is described. The multiconductor flat cable or electrical component having a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.

Multiconductor bonded connection assembly with direct thermal

Disclosed is a strain relief clamp for supporting one or more flexible ribbon cables. A first stiff member has an indentation wider than a flexible ribbon cable, and a height less than the thickness of a flexible ribbon cable. Stacked pliant members are stacked on the first stiff member. Each pliant member has an indentation on the side facing away from the first stiff member. The indentations are substantially equal in width and height to the indentation of the first stiff member. A second stiff member is located on the end of the stack opposite the first stiff member and has a protrusion at least as wide as a flexible ribbon cable facing the indentation of the adjacent pliant member. The protrusion height is such that the sum of its height and the thicknesses of the flexible ribbon cables is greater than the sum of the heights of the indentations of the first stiff member and of the stacked pliant members. Thus, upon clamping the members together, the flexible ribbon cables are compressed when placed in the indentations of the first stiff member and the stacked pliant member adjacent the second stiff member protrusion, providing strain relief of the flexible ribbon cables. The surfaces of the members engaging the flexible ribbon cables each may be textured to improve the friction characteristics.

Strain relief clamp for supporting flexible ribbon cables

A magnetic head is disclosed in which thin strips of shielding are inlaid into the surface of the magnetic head between the read and write gaps for reducing feedthrough. The shielding extends across a substantial portion of the tape-engaging surface between the read and write gaps. Further reduction of feedthrough is achieved by inlaying additional shielding outboard of the read gaps. The shielding does not encircle individual read or write gaps, but may extend across tracks in a multitrack head. The shielding is made of a magnetically permeable material which absorbs magnetic flux which otherwise strays from the magnetic cores. Material and manufacturing costs are maintained low because the shields are small and simple in geometry.

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Tucson, AZ, United States of America

Rudolph Manuel Lopez