Photocircuits Corporation

Rudolph J Armstrong, Jr

An improved method of laminating thermosetting laminates is provided which comprises heating a laminate assembly which comprises a thermosetting resin, measuring the electrical impedance of the thermosetting resin to ascertain its lowest point, and applying full laminating pressure to the heated laminate assembly at that point of increased electrical impedance occurring subsequent to the ascertained lowest point of electrical impedance. An additional improvement is provided which consists of heating a laminate assembly which comprises a thermosetting resin, measuring the electric current generated by heating the thermosetting resin to ascertain its highest point and applying full laminating pressure to the heated assembly at that point of decreased generation of electric current occurring subsequent to the ascertained highest point of electric current. Furthermore, an improved press is provided which is adapted with electrical sensing means to determine the gel stage of the thermosetting resin of a heated thermosetting laminate assembly. Lastly, an improved process of preparing multilayer circuit laminates is provided which comprises treating the surface of a fully cured laminate circuit layer having printed, metallic circuit pattern surfaces with a laminating adhesive resin prior to lamination.

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Hempstead, NY, United States of America

Rudolph J Armstrong, Jr