Mitsubishi Heavy Industries Limited

Universitãt Stuttgart

Rudolf Weber

Saneyuki Goya

Ryuichi Narita

Christian Freitag

Volkher Onuseit

Ehsan Zahedi

Marwan Abdou-Ahmed

Onuseit Volkher

A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

Laser processing method and laser processing apparatus

The invention relates to a drilling device comprising a light source configured to provide a light beam and a diffractive beam propagation device having a substantially planar surface, wherein the light source is configured such that the light beam is incident on the planar surface of the diffractive beam propagation device, and wherein the diffractive beam propagation device is configured to propagate the light beam as one or more propagated beams such that the one or more propagated beams, at least when being integrated over time, surround an area with a substantially circular shape. A use of the drilling device for drilling a hole in a work piece and a method suitable for drilling a hole in a work piece are also provided.

Drilling device, method, and use

Growing community of inventors

Stuttgart, Germany

Rudolf Weber