Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Rudolf Mayrhuber

Gerhard Brehm

Johann Niedermeier

Max Stadler

Manuela Knipf

Jurgen Schuhmacher

A method for the generation of stacking-fault-induced damage on the back of emiconductor wafers is by treating the back with loose hard-material particles which are suspended in a liquid. The back of the semiconductor wafer is brought into contact with the suspended hard-material particles and the hard-material particles are propelled tangentially to the back, under which circumstances they exert on the back of the semiconductor wafer forces which have essentially only tangentially directed components.

Method for the generation of stacking-fault-induced damage on the back

A process and liquid preparation is disclosed for removing residues from ers sawn from crystalline rods. In sawing rod-shaped workpieces such as semiconductor rods, for example, into wafers, by means of an internal-hole saw, auxiliary sawing materials such as for example cutting strips are often attached to the rods. According to the present invention, the residues of such auxiliary sawing materials remaining on the wafers obtained after the sawing operation can be removed particularly easily by means of immersion in baths of aqueous carboxylic solutions and, in particular, aqueous formic acid.

Method and liquid preparation for removing residues of auxiliary sawing

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Munich, Georgia

Rudolf Mayrhuber