Infineon Technologies Ag

Rudolf Lachner

Maciej Wojnowski

Josef Boeck

Linus Maurer

Dirk Hammerschmidt

Thorsten Meyer

Herbert Schäfer

Thomas Meister

Josef Böck

Reinhard J Stengl

Herbert Knapp

Martin Seck

Erich Kolmhofer

Klaus Aufinger

Walter Hartner

Werner Weber

Annalisa Cappellani

Wolfgang Klein

Johann Peter Forstner

Herbert Jaeger

Klaus Goller

Herbert Schaefer

Gerhard Lohninger

Markus Schwerd

Wolfgang Molzer

Michael Schrenk

Wolfgang Liebl

Karl-Heinz Allers

Hans Peter Forstner

A system includes a movable part that is rotatably movable, the movable part comprising a first portion and a second portion; transceiver circuitry configured to transmit a radio signal towards the movable part and to receive a receive radio signal from the movable part; and evaluation circuitry configured to determine a rotational position of the movable part based on the receive radio signal. The first portion of the movable part has a first electromagnetic reflectivity for the radio signal and the second portion of the movable part has a second electromagnetic reflectivity for the radio signal. The first electromagnetic reflectivity differs from the second electromagnetic reflectivity.

Methods and apparatuses for speed and/or position sensing

A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.

Transmission of wireless signal having information on a local oscillator signal

Embodiments relate to machines comprising a movable part, transceiver circuitry configured to transmit a radio signal towards the movable part and to receive a reflection of the radio signal from the movable part, evaluation circuitry configured to determine a position or a speed of the movable part based on at least the received radio signal. A distance between an antenna of the transceiver circuitry and the movable part is less than 5 cm.

A radar system for a vehicle includes an antenna element installable at an outer shell of the vehicle, a dielectric waveguide, and a radar circuit configured to communicate with the antenna element via the dielectric waveguide. A vehicle includes a plurality of radar radio heads arranged at an outer shell of the vehicle, a plurality of waveguides, and a radar circuit configured to generate a common local oscillator signal and simultaneously provide respective radio frequency signal derived from the common local oscillator signal to the plurality of radar radio heads via the plurality of waveguides.

Radar systems for vehicles and methods for operating radar systems of vehicles

A semiconductor radar module includes an integrated circuit (IC) radar device embedded within a wafer level package compound layer, the wafer level package compound layer extending at least partially lateral to the IC radar device. An interface layer abutting the wafer level package compound layer comprises a redistribution layer coupled to the IC radar device for connecting the IC radar device externally. An underfill material extends between the interface layer and an external substrate and abuts the interface layer and the external substrate. The interface layer is disposed between the wafer level package compound layer and the underfill material.

Radar module with wafer level package and underfill

A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially extends lateral to the IC device. The semiconductor module further comprises interconnect structures arranged lateral to the IC device to provide at least one external electrical contact; a patch antenna structure integrated in the semiconductor module and electrically connected to the IC device and a layer interfacing the IC device and the compound, wherein the layer comprises first and second planar metal structures coupled to the IC device, wherein the first planar metal structure is electrically connected to the IC device and the interconnect structures and wherein the second planar metal structure is electrically connected to the IC device and the patch antenna structure.

Integrated antennas in wafer level package

A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.

Wireless communication system, a radar system and a method for determining a position information of an object

A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least one antenna structure and redistribution structures, wherein the antenna structure is coupled to the IC device and wherein the redistribution structures are coupled to the IC device.

A method includes providing a first semiconductor chip comprising a ring-shaped metal structure extending along a contour of a first main surface of the semiconductor chip. The method includes encapsulating the first semiconductor chip with an encapsulation body thereby defining a second main surface and depositing a metal layer over the first semiconductor chip and the encapsulation body. A plurality of external contact pads are placed over the second main surface of the encapsulation body, the metal layer electrically coupling at least one external contact pad of the plurality of external contact pads to the ring-shaped metal structure. A seal ring is placed between the ring-shaped metal structure and the contour of the first main surface of the first semiconductor chip.

Method of forming a ring-shaped metal structure

Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a clip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate.

Packaged antenna and method for producing same

A semiconductor module having one or more integrated antennas in a single package is provided herein. The semiconductor module has a bonding interconnect structure that connects an integrated package to a printed circuit board (PCB), wherein the integrated antenna structures are located at greater center-to-center distance from the IC device than the three dimensional interconnect structures. Therefore, the bonding interconnect structures are confined to a connection area that causes a part of the package containing the one or more antenna structures to extend beyond the bonding interconnect structure as a cantilevered structure. Such a bonding interconnect structure result in a package that is in contact with a PCB at a relatively small area that supports the load of the package.

A method and a system for providing fusing after packaging of semiconductor devices are disclosed. In one embodiment, a semiconductor device is provided comprising a substrate comprising a fuse area, at least one fuse disposed in the fuse area, and at least one layer disposed over the substrate, wherein the at least one layer comprises at least one opening exposing the at least one fuse.

Method and system for providing fusing after packaging of semiconductor devices

A semiconductor module, comprises a package molding compound layer comprising an integrated circuit (IC) device embedded within a package molding compound, the integrated circuit device and the package molding compound having a common surface. Structures are formed to connect the semiconductor module to an external board, the structures electrically connected to the integrated circuit device. A layer is formed on the common surface, the layer comprising at least one integrated antenna structure, the integrated antenna structure being coupled to the IC device.

A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.

A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements that are confined to a relatively small area of the bottom of a package. In particular, the semiconductor module comprises a bonding interconnect structure configured to connect an integrated package to a printed circuit board (PCB), wherein the integrated antenna structures are located at greater center-to-center distance from the IC device than the three dimensional interconnect structures. Therefore, the bonding interconnect structures are confined to a connection area that causes a part of the package containing the one or more antenna structures to extend beyond the bonding interconnect structure as a cantilevered structure. Such a bonding interconnect structure result in a package that is in contact with a PCB at a relatively small area that supports the load of the package.

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Ingolstadt, Germany

Rudolf Lachner