Infineon Technologies Ag

Rudolf Kerler

Michael Bauer

Peter Strobel

Heinz Pape

Wolfram Eurskens

Stephan Stoeckl

Gerold Gruendler

Horst Groninger

An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

Electronic module and method for the production thereof

The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

An apparatus for simultaneously wetting a plurality of electrical contact areas with a liquid includes a punch with nubs or studs made of an elastomer. The number, configuration and dimensions of the nubs are adapted to the contact areas to be wetted. A process for simultaneously wetting a plurality of electrical contact areas with a liquid includes wetting the nubs with the liquid, leading the punch over the contact areas in such a way that the nubs are each disposed over one of the contact areas, and subsequently transferring the liquid from the nubs onto the contact areas.

Process for simultaneously wetting a plurality of electrical contact

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Lappersdorf, Germany

Rudolf Kerler