Draloric Electronic Gmbh

Rudolf Fink

A barrier layer capacitor and a process for producing that capacitor: A central reduction layer formed of ceramic material is produced with a rectangular cross-section. A reoxidation layer is formed on all of the surfaces and is removed from one of the surfaces. Grooves are formed in opposite surfaces, including the one from which the reoxidation layer has been removed. A metal layer is applied around the entire capacitor body, except on the surface from which the reoxidation layer has been removed. Narrow strips are removed from the metal layer on the sides adjacent the surface without the reoxidation layer and at a location slightly away from that reoxidation layer free surface. On the reoxidation layer free surface, a connection coating is applied which extends up to the unremoved portion of the solderable metal coating. The capacitor may be cut from an elongated bar. The bar from which the capacitor may be cut may be the width of two capacitors and it may be separated along the line running through the center into two individual capacitors. In that event, the ceramic bar has a longitudinally extending borehole therethrough which becomes the conductor receiving grooves upon separation of the bar into two pieces.

Barrier-layer capacitor and process for the production thereof

The disclosure concerns a tubular capacitor having a relatively thin tube of dielectric material with metal layers formed on the outer and inner surfaces for forming the capacitor plates. A connecting cap is pushed over the outer layer and is connected electrically with one wire leading out of the capacitor. Another connecting wire extends into the tube and includes a widened portion that is engaged with or extends toward the inner layer. The widened portion is opposed to the pressure on the tube by the connecting cap. Insulation is provided in the exterior of the capacitor between the end of the wire and the connecting cap.

Tubular capacitor with axial connections

The disclosure concerns a capacitive network and also concerns the individual metal layer carrying dielectric layers of which the capacitive network is comprised. Each dielectric layer is comprised of a flat plate having one or two rows of metal layers printed on one surface of it. At least one or perhaps both of the opposite edges of the dielectric layers are formed with grooves or incisions that define respective electric contact areas. There is a respective row of metal layers on the dielectric layer for each edge with grooves. Each metal layer is shaped to have a respective lead portion that extends toward a respective adjacent groove. The lead portions from the metal layers extend toward a first set of alternate grooves, leaving the second alternate set of contact areas not receiving an electric lead of that dielectric layer. Two dielectric layers are overlaid so that their respective rows of metal layers are in overlapping relationship but the dielectric layers are oriented so that metal layers on adjacent dielectric layers are always separate by a layer of dielectric material. The positions of the metal layers on one cooperating dielecetric layer are staggered along the length of the respective dielectric layer with respect to the positions of the metal layers on the adjacent dielectric layer, so that the leads of the metal layers on the adjacent dielectric layer extend toward the second set of alternate grooves, toward which the leads from the metal layers of the first dielectric layer did not extend. Electric diodes may be electrically connected between the grooves, whereby the diodes are connected in series along the grooves.

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Selb, Germany

Rudolf Fink