Roche Diagnostics Gmbh

Codman & Shurtleff, Inc.

Rudolf Buser

Olivier Elsenhans

Nicolas Szita

Herbert Keppner

Juergen Burger

Frank Zumkehr

Felix Baader

J&uuml;rgen Burger

The present invention is directed a system for coupling a macroactuator to a movable element of a micromachined device. The system includes a micromachined device, a first body for holding a macroactuator, a macroactuator mechanically mounted on the first body, a second body having a bore for receiving the first body, a screw arrangement for fixing the axial position of the first body within the bore of the second body, and a plate arrangement for mounting the micromachined device on the second body. The plate arrangement is mounted in such a way that the macroactuator exerts a predetermined force or pressure on a movable element of the micromachined device. The present invention further is directed to a pipetting module that includes the micromachined device and the macroactuator.

Actuator coupling system and a pipetting module comprising such a coupling system

A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.

Thermal flow sensor having recesses in a substrate

Micromechanical pipetting device

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Grabs, Switzerland

Rudolf Buser