Epcos Ag

Rudolf Bart

Claus Reitlinger

Frank Rehme

The invention relates to a module package which comprises a module substrate, a chipapplied using the flip chip process, and an encapsulation layer, and to a method for producing same. The chiphas component structures on the top sidethereof. Said top saidfaces the module carrier, wherein a gapis formed between the top sideof the chip and the module carrier. A filler is added to the encapsulation layer. The encapsulation layerpartly fills underneath the chip, wherein at most the part of the chip, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layercompletely encloses the sides of the chip

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Taufkirchen, Germany

Rudolf Bart