Texas Instruments Corporation

Ruby Ann Maya Merto

Jerry Gomez Cayabyab

Roxanna Bauzon Samson

Jason Binay-an Colte

Edsel Gomez Balagtas

Lorraine Rivera Duldulao

A method of making a plurality of integrated circuit ('IC') packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.

Method and apparatus for making integrated circuit packages

A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit ('IC') component stacks mounted on the leadframe strip.

Growing community of inventors

Baguio, Philippines

Ruby Ann Maya Merto