Viasystems Technologies Corp. L.l.c.

Ddi Global Corp.

Ruben Zepeda

Rajwant Sidhu

Michael Jon Taylor

Monte P Dreyer

Raj Kumar

Carlos A Lopez

Michael J Taylor

The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.

Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap

Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards are described. One such method includes applying a first resist layer on a substrate having a first copper layer, applying a first image to the first resist layer, developing the first resist layer in accordance with the first image, applying a second copper layer on the first copper layer, electroplating a first metallic layer on the second copper layer, removing the first resist layer, etching a portion of the first copper layer, removing the first metallic layer, depositing a third copper layer on a surface of the assembly, applying a second resist layer on the third copper layer, applying a second image to the second resist layer, developing the second resist layer in accordance with the second image, electroplating a preselected metal layer on the third copper layer, removing the second resist layer, and etching a portion of the third copper layer.

Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards

Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed therethrough; and a counter paste filled within the via.

Manufacturing methods of multilayer printed circuit board having stacked via

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Yorba Linda, CA, United States of America

Ruben Zepeda