Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Rogers Germany Gmbh

Ruben Kahle

Andreas Meyer

Karsten Schmidt

Tanja Braun

Michael Töpper

Eckart Hoene

Karl-Friedrich Becker

Tina Thomas

Tanja Dr Braun

Michael Dr Töpper

Christoph Marczok

A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.

Method for manufacturing an electronic component and an electronic component

Growing community of inventors

Berlin, Germany

Ruben Kahle