Intel Corporation

Ruander Cardenas

Mark Angus MacDonald

Juha Paavola

Justin Michael Huttula

Jerrod Peterson

James Raupp

Evan Piotr Kuklinski

David Kennedy

Jeff Ku

Mark Charles Carbone

Prakash Kurma Raju

Vivek Paranjape

Prasanna Pichumani

Daniel J Ragland

Gavin Sung

Gustavo Fricke

Arnab Sen

Hua Yang

Kannan G Raja

Gokul V Subramaniam

Lance Lin

Jason Y Jiang

Kathiravan D

Baomin Liu

Xiyong Tian

Twan Sing Loo

Jia Yan Go

Columbia Mishra

Akhilesh P Rallabandi

Christopher M Moore

Hari Shanker Thakur

Gerry Juan

Ritu Bawa

Chin Kung Goh

Mark Macdonald

Patrick Douglas James

Ellann Cohen

George Baoci Sun

Shih Wei Nien

Gaurav Patankar

Chun-Ting Liu

Javed Shaikh

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Heterogeneous heat pipe solutions provide both low thermal resistance and a high Q. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.

Interleaved heterogeneous heat pipes with different Q

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

Heatsink with a sandwich plate construction

Volumetric resistance blowers are disclosed herein. An example volumetric resistance blower includes a housing, a motor, and a rotor disposed within the housing and rotated by the motor. The rotor is constructed of metal foam.

Volumetric resistance blowers

Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a printed circuit board, a heat source located on the printed circuit board, and an active loading mechanism secured to the printed circuit board. The active loading mechanism is over the heat source and includes shape memory material. When the shape memory material is not activated, the active loading mechanism applies a first load on the heat source and when the shape memory material is activated, the active loading mechanism applies a second load on the heat source.

Activate loading mechanism

Growing community of inventors

Hillsboro, OR, United States of America

Ruander Cardenas