Hewlett-packard Development Company, L.p.

Cisco Technology, Inc.

Hewlett-packard Company

Roy M Zeighami

Christian Laszlo Belady

Brent A Boudreaux

Eric C Peterson

Shaun Lee Harris

Brandon Rubenstein

Brian Matthew Johnson

James Leach

Robert B Curtis

Glenn Cochran Simon

Gary Williams

Stuart C Haden

Paul Anthony Wirtzberger

John M Wastlick

Jeffrey Christenson

Michael C Day

Gururaja A Nittur

David Soper

Jeffrey N Metcalf

Stacy A Fraker

Mike Devon Giraldo

Praveen K Jagadishprasad

Glen Edwards

James Steven Wells

Greg Huff

Antony J Harvey

Robert Lankston

David A Klein

A server rack holds a number of modular servers configured for liquid cooling by passing a liquid coolant through interiors of the servers. Failure management of the cooling system is by management of the servers in segregated fault domains. Each fault domain comprises a number of the servers serviced by a dedicated coolant circuit that is segregated from the cooling circuits of the other fault domains. Potential liquid coolant leaks in a specific fault domain can be identified by monitoring liquid coolant levels in the respective coolant circuits. Each fault domain can include a separate, dedicated heat exchanger and a separate, dedicated coolant reservoir.

Liquid cooling of rack-mounted electronic equipment

A data center system management device receives power configuration information for one or more power groups. Each power group has one or more servers. The power configuration information has a power group power limit for each power group. The power budgets are sent to server control units within each power group. Messages are received from each of the server control units, the messages including information to indicate whether servers in the power groups have a power deficit or a power surplus, and a number of power units for the power deficit and power surplus for each server. The server power budgets of the one or more servers in each of the one or more power groups based on power deficits and power surpluses within each power group using a priority based reallocation mechanism.

Large scale dynamic power budget adjustments for optimizing power utilization in a data center

Flow measurement systems and methods are provided. A flow measurement system can include at least one heat-producing computing device having at least one fluid inlet and one fluid outlet. The system can further include at least one inlet fluid temperature sensor and at least one outlet fluid temperature sensor. At least one current sensor measuring the current supplied to at least a portion of the at least one heat-producing computing device can also be included with the system. The system can also include at least one calculating device adapted to calculate the inlet fluid flow rate based at least in part upon the sensed inlet fluid temperature, the sensed outlet fluid temperature, and the sensed current flow.

Fluid flow control for computing device

Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Heat storage by phase-change material

According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into which the electronic equipment, when installed in the rack, exhausts gas drawn from a first section of a facility. The system further comprises a gas flow meter for measuring gas flow in the exhaust duct, and a controller for generating control signals to control, based on the measured gas flow, the output of a cooling unit arranged to provide cooled gas to the first section of the facility.

Cooling system

A method and system for correcting errors in a memory subsystem in a computer system. Occurrence of correctable memory errors are monitored and a determination is made whether the risk of an occurrence of an uncorrectable memory error is less than a tolerable risk. If the risk of an occurrence of an uncorrectable memory error is not less than the tolerable risk, at least one system level parameter is adjusted to decrease the occurrence of correctable memory errors.

Method and system for performing system-level correction of memory errors

An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Multi-processor module

One embodiment is a method of dynamically adjusting a rate at which a dynamic random access memory ('DRAM') module is refreshed in a computer system. The method comprises monitoring a plurality of system conditions; detecting a change in at least one of the monitored system conditions; responsive to the detection, determining an optimum refresh rate for a current state of the computer system; and setting the refresh rate to the determined optimum refresh rate.

Method and system for dynamically adjusting DRAM refresh rate

Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base.

Thermally expanding base of heatsink to receive fins

A loop thermosyphon system has a semiconductor die with a plurality of microchannels. A condenser is in fluid communication with the microchannels. A wicking structure wicks fluid between the condenser to the semiconductor die.

Loop thermosyphon with wicking structure and semiconductor die as evaporator

A heat sink is constructed including at least one heat sink fin. Each fin includes an opening sized to fit a thermal device when the fins are heated to a temperature above that of the thermal device. When the fins cool to the temperature of the thermal device they shrink in size and form a tight compression fit around the thermal device.

Heat sink

A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Thermal pouch interface

A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined intervals, wherein the one or more heat pipes intersects the plurality of thermal plates, and an opening fashioned in each one of the plurality of thermal plates.

System and method for cooling electronic assemblies

The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and such that gravity pressurizes cooler condenser fluid towards the die. A semiconductor plate such as glass may couple with the die to seal the micro-channels and to form a plurality of fluid conduits for the fluid. Generally, the fluid is alcohol. A first fluid conduit and a second fluid conduit couple between the die's micro-channels and the condenser to form a closed loop thermosyphon system. The condenser is preferably constructed and arranged above the die such that gravity forces cooler fluid to the micro-channels. The micro-channels may be shaped for preferential fluid flow along one direction of the die. The condenser may contain fins to enhance heat transfer to air adjacent the condenser.

Growing community of inventors

Piano, TX, United States of America

Roy M Zeighami