Universal Instruments Corporation

Roy M Whiting

Phillip A Ragard

Michael D Snyder

Henry J Soth

Frank J Orzelek

Erwin F Bates

An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.

Automated hybrid circuit board assembly apparatus

An apparatus for receiving a plurality of electrical components having a body portion and coaxial leads extending in opposite directions therefrom and securing said components in lengths of heat sealed tape on their extremities.

Heat sealing device for component taping apparatus

A pair of pivoting, spring-loaded blades positioned in the path of travel of a series of electronic components on a continuous conveyor, center the components on the conveyor; and a plurality of free-moving fingers rest on the components in order to maintain a centered condition as the components are conveyed into the taping mechanism of a component taping machine.

Taped belt electronic component centering device

An apparatus for sequentially feeding axial lead electrical components to a first plane, severing surplus lead material, bending one lead so that said component and said other lead are perpendicular to the first plane, preforming the end of the other lead into an L-shape, bending the remaining section of the one lead to be perpendicular to the first plane and inserting the leads into holes in a circuit board.

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Binghamton, NY, United States of America

Roy M Whiting