Sensarray Corporation

Kla Tencor Corporation

Roy Gordon

Wayne Glenn Renken

Earl M Jensen

Mei H Sun

Brian Paquette

Peter Michael Noel Vandenabeele

Paul Miller

A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.

Integrated process condition sensing wafer and data analysis system

A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition measuring device to a user with little or no human intervention.

A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. A process condition measuring device surveys conditions in a target environment and records them in a memory for later transmission or downloading.

Systems and methods are described for integrated (embedded) semiconductor wafer temperature measurement equipment and processes. An integrated wafer temperature measurement apparatus, comprising: a substrate; a placement resource formed in said substrate; a sensor lead located in said placement resource, said sensor lead having a first end and a second end; a sensor coupled to said first end of said sensor lead and located in said placement resource; and a sensor lead cover coupled to said substrate. The systems and methods provide advantages in that reliability is enhanced, installation and removal are facilitated, and accuracy is improved by obviating any shadowing of the substrate and reducing temperature gradients near the sensor.

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San Jose, CA, United States of America

Roy Gordon