Few Fahrzeugelektrikwerk Gmbh & Co. Kg

Roy Gleisberg

André Jenrich

Björn Schneider

The invention relates to a solderable electric connection element including a crimping portion for receiving a connection cable and a soldering portion for bonding to the surface of an electrically conductive structure. The soldering portion directly adjoins the crimping portion or is offset therefrom by means of a transition portion, and a solder deposit is provided or can be placed on the solder region. According to the invention, an angled section is formed in the section between the crimping and soldering region or in the transition region such that the crimping and soldering region are arranged in a back-to-back position, wherein the free face of the soldering region receives the solder deposit.

Solderable electric connection element

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.

Method for forming a bonded joint

An electrical connection arrangement is provided between at least one flat conductor or conductor portion and a cable, the flat conductor or conductor portion leading to a pane, and electric or electronic components situated there, and the cable being an integral part of an external connection. The flat conductor or conductor portion is formed on a carrier film, and has an encapsulation as a plastic injection overmolding in the area of the electric contacting point of cable and flat conductor or conductor portion. An adhesion-promoting, heat-activated adhesive film is applied in the area of the carrier film while leaving the space for the electrical contacting point, yet surrounding or two-dimensionally delimiting same.

Electrical connection arrangement

The invention relates to a contacting arrangement for conductors provided on flat structures, namely glass panes, the conductors having a contact point in their connecting section, wherein one end of a connecting cable or another connection device is electrically and mechanically connected with a pad including a conductive fleece or double-sided conductive adhesive tape, wherein the connecting cable configured in this way is introduced into an encasement block which is open at one side and which includes a frame which surrounds the fleece or the conductive adhesive tape and which is provided with adhesive, wherein the surface of the conductive fleece which is laterally defined by the frame is matched to the area of the contact point in order to provide a contact connection between the contact point and the fleece surface through an adhesive joint between the frame and the flat structure, wherein the frame with the encasement element closes off the contact point in sealing fashion towards the ambient and a portion of the frame is usable as a sealing lip for preventing adhesives from spreading out when the glass pane is fitted.

Contact making arrangement for conductors provided on flat structures, namely panes of glass

The present invention relates to a contacting assembly for conductors that are present on flat structures, in particular glass panels, and have a contact point in the connection section. According to the invention, an end of a connecting cable or of another connecting means, for example, a connecting plug, is connected electrically and mechanically to a pad made of a conductive nonwoven fabric. The connecting cable thus assembled is introduced into a casting block which is open on one side and which has a frame that is provided with adhesive and encloses the nonwoven fabric. The surface of the conductive nonwoven fabric which is delimited laterally by the frame is matched to the area of the contact point, in order to produce, via an adhesive bond between the frame and the flat structure, a contacting connection created by surface pressing between the contact point and the nonwoven fabric surface, wherein the frame together with the casting body seals the contact point with respect to the surrounding area.

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Markranstädt, Germany

Roy Gleisberg