Growing community of inventors

Boise, ID, United States of America

Roy Edward Meade

Average Co-Inventor Count = 2.08

ph-index = 9

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 391

Roy Edward MeadeGurtej S Sandhu (44 patents)Roy Edward MeadeVladimir Marko Stojanovic (28 patents)Roy Edward MeadeMark Taylor Wade (24 patents)Roy Edward MeadeChen Sun (22 patents)Roy Edward MeadeAlexandra Carroll Wright (19 patents)Roy Edward MeadeMilos A Popovic (12 patents)Roy Edward MeadeJohn Fini (12 patents)Roy Edward MeadeRajeev J Ram (11 patents)Roy Edward MeadeDerek Van Orden (11 patents)Roy Edward MeadeSumeet C Pandey (8 patents)Roy Edward MeadeLei Bi (7 patents)Roy Edward MeadeZvi Sternberg (7 patents)Roy Edward MeadeOfer Tehar-Zahav (7 patents)Roy Edward MeadeMichael Davenport (6 patents)Roy Edward MeadeJohn A Smythe (5 patents)Roy Edward MeadeJason Scott Orcutt (5 patents)Roy Edward MeadeJeffrey Michael Shainline (5 patents)Roy Edward MeadeForrest G Sedgwick (5 patents)Roy Edward MeadeShahab Ardalan (5 patents)Roy Edward MeadeKaran Mehta (4 patents)Roy Edward MeadeChong Zhang (4 patents)Roy Edward MeadeEfraim Megged (4 patents)Roy Edward MeadeBhaskar Srinivasan (3 patents)Roy Edward MeadeChen Li (3 patents)Roy Edward MeadeHugo Saleh (3 patents)Roy Edward MeadeCharles Wuischpard (3 patents)Roy Edward MeadeHaiwei Lu (3 patents)Roy Edward MeadeChandra V Mouli (2 patents)Roy Edward MeadeSanh D Tang (2 patents)Roy Edward MeadeScott E Sills (2 patents)Roy Edward MeadeJohn K Zahurak (2 patents)Roy Edward MeadeDavid H Wells (2 patents)Roy Edward MeadeMichael P Violette (2 patents)Roy Edward MeadeYushi Hu (2 patents)Roy Edward MeadeSong Guo (2 patents)Roy Edward MeadeAnatol Khilo (2 patents)Roy Edward MeadeAshonita A Chavan (1 patent)Roy Edward MeadeQian Tao (1 patent)Roy Edward MeadeVan Derek Orden (1 patent)Roy Edward MeadeRoy Edward Meade (131 patents)Gurtej S SandhuGurtej S Sandhu (1,435 patents)Vladimir Marko StojanovicVladimir Marko Stojanovic (126 patents)Mark Taylor WadeMark Taylor Wade (44 patents)Chen SunChen Sun (42 patents)Alexandra Carroll WrightAlexandra Carroll Wright (23 patents)Milos A PopovicMilos A Popovic (46 patents)John FiniJohn Fini (26 patents)Rajeev J RamRajeev J Ram (59 patents)Derek Van OrdenDerek Van Orden (34 patents)Sumeet C PandeySumeet C Pandey (35 patents)Lei BiLei Bi (17 patents)Zvi SternbergZvi Sternberg (7 patents)Ofer Tehar-ZahavOfer Tehar-Zahav (7 patents)Michael DavenportMichael Davenport (15 patents)John A SmytheJohn A Smythe (145 patents)Jason Scott OrcuttJason Scott Orcutt (91 patents)Jeffrey Michael ShainlineJeffrey Michael Shainline (11 patents)Forrest G SedgwickForrest G Sedgwick (10 patents)Shahab ArdalanShahab Ardalan (5 patents)Karan MehtaKaran Mehta (8 patents)Chong ZhangChong Zhang (8 patents)Efraim MeggedEfraim Megged (4 patents)Bhaskar SrinivasanBhaskar Srinivasan (74 patents)Chen LiChen Li (26 patents)Hugo SalehHugo Saleh (3 patents)Charles WuischpardCharles Wuischpard (3 patents)Haiwei LuHaiwei Lu (3 patents)Chandra V MouliChandra V Mouli (319 patents)Sanh D TangSanh D Tang (306 patents)Scott E SillsScott E Sills (236 patents)John K ZahurakJohn K Zahurak (158 patents)David H WellsDavid H Wells (155 patents)Michael P VioletteMichael P Violette (123 patents)Yushi HuYushi Hu (37 patents)Song GuoSong Guo (11 patents)Anatol KhiloAnatol Khilo (11 patents)Ashonita A ChavanAshonita A Chavan (44 patents)Qian TaoQian Tao (32 patents)Van Derek OrdenVan Derek Orden (4 patents)
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Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (90 from 37,640 patents)

2. Ayar Labs, Inc. (41 from 74 patents)

3. Massachusetts Institute of Technology (4 from 8,321 patents)


131 patents:

1. 12416763 - Fiber attach enabled wafer level fanout

2. 12412745 - Electronic systems including two-dimensional material structures

3. 12321022 - Apparatus for optical fiber-to-photonic chip connection and associated methods

4. 12313891 - Thermal management system for multi-chip-module and associated methods

5. 12092880 - Beam steering structure with integrated polarization splitter

6. 12057332 - Wafer-level etching methods for planar photonics circuits and devices

7. 12019269 - Multi-chip packaging of silicon photonics

8. 12014962 - Systems and methods for wafer-level photonic testing

9. 11994724 - Chip-to-chip optical data communication system

10. 11916602 - Remote memory architectures enabled by monolithic in-package optical i/o

11. 11899251 - Vertical integrated photonics chiplet for in-package optical interconnect

12. 11867944 - Photonic systems to enable top-side wafer-level optical and electrical test

13. 11823990 - Chip-last wafer-level fan-out with optical fiber alignment structure

14. 11822128 - Fiber attach enabled wafer level fanout

15. 11799554 - Laser module for optical data communication system within silicon interposer

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10/3/2025
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