Delphi Technologies, Inc.

Delco Electronics Corporation

Roy Alan Visser

Daniel A Lawlyes

Morris D Stillabower

Jeffrey L Mc Grew

An electronic module is provided having enhanced thermal cooling of electronics. The module includes a housing, electronic circuitry contained within the housing, and a fluid cooling chamber extending through the housing. The chamber has generally conical shaped portions at opposite ends. At least one thermal cooling insert extends into the chamber. The insert comprises a plurality of projections for forming fluid flow passages between adjacent projections, wherein the projections engage the generally conical shape portion of the chamber.

Electronic module having thermal cooling insert

A method and an apparatus for increasing the convective heat transfer capabilities of a liquid cooler coupled to various system and vehicle components. The apparatus includes a structure placed within a hollow tubing of the liquid cooler to distort the laminar flow of fluid within a center portion of the hollow tubing, which decreases the temperature rise of the fluid along an outer wall of the hollow tubing associated with laminar flow. In preferred embodiments, the structure has an elongated baffle wire or an extruded elongated ridge member. The structure allows the outer surface of the tubing to have increased cooling at a particular liquid flow rate. As a result, there is an increase in heat transfer capability to a coupled system or vehicle component.

Laminar flow optional liquid cooler

A flat twisted electrical terminal is provided for connecting a first circuit element to a second circuit element on respective first and second circuit boards. The terminal includes a flat conductive member having a first end for connecting to a first circuit element and a second end for connecting to a second circuit element. The conductive member is axially twisted about its longitudinal axis.

Twisted flat electrical terminal

An engine control module is provided, including a die-cast base portion having a plurality of die cast post elements . A cover element is positioned such that each of the plurality of die-cast post elements project through a plurality of cover holes formed in the cover element . The plurality of die-cast post elements are staked such that the cover element 14 is secured to the base portion.

Automotive electronics control module enclosure

An electronics assembly is provided, including a base element and a cover element The base element includes a perimeter mating groove and the cover element including a perimeter tongue element A plurality of crush ribs are formed into the perimeter tongue element such that when the perimeter tongue element is positioned within the perimeter mating groove during assembly, the plurality of crush ribs establish conductive contact between the base element and the cover element

Electronic enclosure with improved EMC performance

A liquid-cooled heat-sink including a cooling housing defining a cooling chamber where the chamber is positioned adjacent to a semi-conductor device or devices to be cooled. An inlet port introduces a liquid coolant into the chamber and an exit port removes the liquid coolant from the chamber. A single unit plastic baffle is positioned within the chamber. The baffle includes strategically configured plenums, jet ports and transfer ports that direct the liquid coolant in both a series and parallel manner for increased cooling efficiency. The jet ports direct the liquid coolant onto the semiconductor devices in a parallel manner, and liquid coolant is transferred from one set of jets to another set of jets in a series manner.

Growing community of inventors

Greentown, IN, United States of America

Roy Alan Visser