E.i. Dupont De Nemours and Company

Roxy N Fan

Abraham B Cohen

John Anthony Quinn

John Alan Lawton

Mario Grossa

Michael Fryd

Reid E Kellogg

A photosensitive element having an infrared imageable layer, and a process for making a relief image from such an element are disclosed.

Process and element for making a relief image using an IR sensitive layer

A method and apparatus, where high viscosity liquids, including pseudoplastic, plastic flow, and thixotropic liquids, as well as gels, semi-solid, and solid materials are viscosity reduced during coating and allowed to increase in viscosity during imaging steps, for use in Solid Imaging applications. Use of these materials and the apparatus improves coating uniformity and final object tolerances.

Method for forming solid objects utilizing viscosity reducible

A method and composition for forming investment casting patterns wherein thermally-collapsible microspheres are incorporated into the pattern composition. The patterns can be made either by conventional pattern forming techniques or by solid imaging techniques. After investing the microsphere containing pattern in the ceramic shell, the pattern and shell are heated, causing a collapse of the microspheres and thereby preventing cracking of the shell. The shell is then heated to burn-out the remaining pattern material and fire the shell, thereby creating a mold.

Investment casting pattern material comprising thermally-collapsible

A photosensitive printing element having an IR ablatable layer and at least one barrier layer as set forth within and a process for making a flexographic printing plate from such an element are disclosed.

Flexographic printing element having an IR ablatable layer and process

Investment casting method and pattern material comprising

An apparatus and method for fabricating integral three-dimensional objects from successive layers of photoformable compositions by exposing the layers of the composition through a detachable flexible transparent film, one side of the film being in contact with the composition and the other side of the film with a rigid transparent plate, which guides and supports the film.

Solid imaging system

The invention is directed to a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises

Embedded catalyst receptors for metallization of dielectrics

An integral three dimensional object is formed from a photohardenable liquid composition containing radiation deflecting matter which is a thermal insulator and having a different index of refraction from the liquid.

Solid imaging method using photohardenable compositions containing

A solid imaging method utilizing photoformable compositions comprising thermally coalescible materials for producing multilayer models and prototypes having improved structural properties and resolution.

Solid imaging method utilizing compositions comprising thermally

A three-dimensional object formed from a photohardenable composition containing deflecting matter of core-shell polymers. A preferred material for the polymeric core is crosslinked to an extent to be nonswellable and insoluble in solvent for noncrosslinked polymer material while the shell polymer has no pendant acid groups.

Solid imaging method using compositions containing core-shell polymers

An integral three-dimensional object is formed from a photohardenable liquid composition containing radiation deflecting matter.

Solid imaging method using multiphasic photohardenable compositions

An integral three-dimensional object is formed from a photohardenable liquid composition containing radiation deflecting matter whereby a difference in an index of refraction increases by more than 0.01 after photohardening.

Solid imaging method using photohardenable materials of self limiting

The invention is directed to a laminate for the preparation of a multilayer printed circuit by electroless plating of conductive metal thereon which comprises

Method for making multilayer circuits using embedded catalyst receptors

Process for preparing multilayer printed circuits comprising laminating to a substrate bearing a circuit pattern or electrically conductive surface a photosensitive layer which is tacky or becomes tacky upon exposure; exposing the laminate to actinic radiation through a via image related to the underlying circuit pattern, if present; optionally removing the removable via image of the photosensitive layer in either the exposed or unexposed areas, e.g., with a solvent or peeling apart by removal of a cover sheet, if present; laminating to the remaining tacky photosensitive layer a layer of a second photosensitive composition; exposing the laminate to actinic radiation through a registered image pattern of at least one overlying segment of the via image area and conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; removing the removable circuit image areas of the photosensitive layer in the exposed or unexposed areas with a solvent therefor, or peeling apart by means of a cover sheet, if present, the removable via image areas of the lower photosensitive, if present, are removed by a solvent therefor; embedding finely divided material, e.g., copper, into the tacky areas; optionally curing the laminate by means of actinic radiation and/or heat; plating electrolessly to form an interconnected electrically conductive circuit. Additional circuit layers can be added.

Preparation of photoformed plastic multistrate by via formation first

Process for preparing multilayer printed circuits comprising laminating simultaneously or sequentially to a substrate bearing a circuit pattern two photopolymerizable layers, the lower layer formulated for bulk response as defined and the upper layer formulated for surface response as defined; exposing the laminate to actinic radiation through a circuit image related to the circuit pattern on the substrate; embedding finely divided metal, e.g., copper, to the tacky image areas; exposing the toned laminate to actinic radiation through an image of at least one overlying segment of the conductive circuit pattern; removing unexposed photopolymer from the two layers to form vias; embedding finely divided metal, e.g., copper, or catalyst to the side walls of the vias; optionally, curing the image by exposing to actinic radiation and/or by heating; plating to form an interconnected electrically conductive circuit. Additional circuit layers can be added by repeating the process using the newly plated circuit pattern as a substrate.

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E. Brunswick, NJ, United States of America

Roxy N Fan