Texas Instruments Corporation

North Carolina State University

Rovindra Dat

Orlando H Auciello

Angus Ian Kingon

Ken D Gifford

Husam N Al-Shareef

Dan J Lichtenwalner

An improved structure for a thin multilayer capacitor where the electrodes are formed only on a portion of the ends of the package to reduce the footprint on the circuit board and the amount of noble metal used for each unit. The improved structure results from a manufacturing method that has additional advantages of reduced fabrication costs and fewer manufacturing steps.

Thin multilayer ceramic capacitors

A portable computer (5) having a lightweight case are disclosed. The case includes a top panel (10) and a bottom panel (8), each with side panels (14t; 14b) integrally molded therewith or otherwise attached thereto. The top panel (10) and bottom panel (8) each are molded to have an inner surface portion (30; 28) having a checkerboard pattern of protrusions (20) and recessed portions (22). The side panels (14t; 14b) are of the full thickness of the protrusions (20), to provide structural support for the computer (5). Other panels (12; 18) may be similarly constructed to have checkerboard patterns of protrusions (20) and recessed portions (22), as desired.

Portable computer with reduced weight case with protruding and recessed

Ferroelectric capacitors with hybrid electrodes including both a conducting oxide and a noble metal may be used to achieve devices having improved performance over capacitors with either platinum or ruthenium oxide electrodes. These hybrid electrode structures can improve capacitor performance both in terms of fatigue and leakage current. Accordingly, these ferroelectric capacitors with hybrid electrodes can be used as elements of an integrated circuit such as a non-volatile memory or dynamic random access memory.

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Dallas, TX, United States of America

Rovindra Dat