Triton Microtechnologies

Heraeus Deutschland Gmbh & Co Kg

Trinton Microtechnologies

Roupen Keusseyan

Tim Mobley

Charles Tucker

Klaus Kunze

Aziz S Shaikh

Isao Tanaka

Christian Muschelknautz

Toshinori Wada

The invention relates to an electro-conductive paste comprising Ag nano-particles and spherical Ag micro-particles in the preparation of electrodes, particularly in electrical devices, particularly in temperature sensitive electrical devices or solar cells, particularly in HIT (Heterojunction with Intrinsic Thin-layer) solar cells. In particular, the invention relates to a paste, a process for preparing a paste, a precursor, a process for preparing an electrical device and a module comprising electrical devices. The invention relates to a paste comprising the following paste constituents:

Electro-conductive paste comprising Ag nano-particles and spherical Ag micro-particles in the preparation of electrodes

A paste material for filling a through-hole for improved adhesion and hermeticity in glass substrates. In some embodiments, the paste material comprises a metal, a glass frit composition, a solvent, a resin, a conductive or non-conductive inert additive, or mixtures thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components

A glass substrate and method of processing the glass substrate for use in semi-conductor packaging applications. The glass substrate has top surface and a bottom surface. At least one through-hole extends from the top surface to the bottom surface of the glass substrate. At least one interior layer is disposed inside the through-hole. At least one external layer is disposed on the top surface and at least one external layer is disposed on the bottom surface. The through holes of the glass substrate are filled with a metallized paste material using thick film technology. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

A method for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. Through-holes are created in a glass substrate and filled with a conductive type material. Backside metallized pads are applied to the glass substrate and enclosed with an under-bump metallization (UBM) pad. A sacrificial substrate is removeably attached to the glass substrate. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and under-bump metallization (UBM) pads, and reinforces the glass substrate.

System and method for metallization and reinforcement of glass substrates

A system for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. A sacrificial substrate is removeably attached to a glass substrate comprising through-holes, backside metallized pads, and under-bump metallization (UBM) pads enclosing the backside metallized pads. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and UBM pads, and reinforces the glass substrate.

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Carlsbad, CA, United States of America

Roupen Keusseyan