Micron Technology Incorporated

Round Rock Research, LLC

Micron Communications, Inc.

Aptina Imaging Corporation

Ross S Dando

Craig M Carpenter

Allen P Mardian

Philip H Campbell

Gurtej S Sandhu

Mark E Tuttle

Dan Gealy

Kevin T Hamer

Raynald B Cantin

Garo Jacques Derderian

Kimberly R Tschepen

Rickie C Lake

William Mark Hiatt

Danny Dynka

Durai Vishak Nirmal Ramaswamy

Swarnal Borthakur

Joel A Drewes

Steven David Oliver

Eric Blomiley

Kevin W Hutto

Randy W Mercil

Krishna Kumar

Kyle K Kirby

Li Li

Weimin Li

Neal R Rueger

Richard A Mauritzson

Rick C Lake

Donald Lee Black

Scott Richard Cyr

Douglas Clark

Methods for forming interconnects in microfeature workpieces, and microfeature workpieces having such interconnects are disclosed herein. The microfeature workpieces may have a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side. In one embodiment, a method includes (a) constructing an electrically conductive interconnect extending from the terminal to at least an intermediate depth in the substrate with the interconnect electrically connected to the terminal, and (b) removing material from the second side of the substrate so that a portion of the interconnect projects from the substrate.

Microfeature workpieces and methods for forming interconnects in microfeature workpieces

A semiconductor structure comprises conductive vias extending from an active surface of a substrate to a back side of the substrate and surrounded by a dielectric material. The conductive vias are surrounded by recessed isolation structures formed within the back side of the substrate. Conductive elements extend over the conductive vias and laterally over at least portions of the isolation structures. The conductive elements are in electrical contact with the conductive vias and electrically isolated from the substrate by the isolation structures. Thermally conductive elements in contact with the substrate are laterally spaced from the conductive elements. Die assemblies comprising the semiconductor structure, methods of forming the semiconductor structure, and methods of forming the die assemblies are also disclosed.

Semiconductor structures and die assemblies including conductive vias and thermally conductive elements and methods of forming such structures

Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces are disclosed herein. In one embodiment, a method includes depositing molecules of a gas onto a microfeature workpiece in the reaction chamber and selectively irradiating a first portion of the molecules on the microfeature workpiece in the reaction chamber with a selected radiation without irradiating a second portion of the molecules on the workpiece with the selected radiation. The first portion of the molecules can be irradiated to activate the portion of the molecules or desorb the portion of the molecules from the workpiece. The first portion of the molecules can be selectively irradiated by impinging the first portion of the molecules with a laser beam or other energy source.

Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces

A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or the at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.

Apparatuses facilitating fluid flow into via holes, vents, and other openings communicating with surfaces of substrates of semiconductor device components

In one aspect, the invention encompasses a method for electronic tracking of units originating from a common source which comprises a plurality of units physically joined with one another. A first transponder is physically associated with the common source, and the source is split to separate it into three or more of the units. A second transponder is physically associated with one of the three or more units, and the second transponder sends a code. The code of the second transponder is electrically associated with an identifier of the common source. In a particular aspect, the common source is an animal carcass.A batch comprises separate units of objects that are physically joined together. RFID tags are attached to each of the units and to the batch. The codes stored in the RFID tags are electrically associated with one another in the database.

Method for electronic tracking of units associated with a batch

An integrated circuit for use, for example, in a backside illuminated imager device includes circuitry provided on a first side of a substrate, a first conductive pad connected to the circuitry and spaced from the first side of the substrate, a second conductive pad spaced from a second side of the substrate, an electrically conductive interconnect formed through the substrate to interconnect the first and second conductive pads, and a dielectric surrounding the second conductive pad and at least a portion of the interconnect. Methods of forming the integrated circuit are also described.

Isolated bond pad with conductive via interconnect

A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.

Methods for causing fluid to flow through or into via holes, vents and other openings or recesses that communicate with surfaces of substrates of semiconductor device components

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.

Systems and methods for depositing conductive material into openings in microfeature workpieces

In one aspect, the invention encompasses a method for electronic tracking of units originating from a common source which comprises a plurality of units physically joined with one another. A first transponder is physically associated with the common source, and the source is split to separate it into three or more of the units. A second transponder is physically associated with one of the three or more units, and the second transponder sends a code. The code of the second transponder is electrically associated with an identifier of the common source. In a particular aspect, the common source is an animal carcass.A batch comprises separate units of objects that are physically joined together. RFID tags are attached to each of the units and to the batch. The codes stored in the RFID tags are electrically associated with one another in a database.

System and method for electronic tracking of units associated with a batch

Methods and systems for forming electrical interconnects through microelectronic workpieces are disclosed herein. One aspect of the invention is directed to a method of manufacturing an electrical interconnect in a microelectronic workpiece having a plurality of dies. Each die can include at least one terminal electrically coupled to an integrated circuit. The method can include forming a blind hole in a first side of the workpiece, and forming a vent in a second side of the workpiece in fluid communication with the blind hole. The method can further include moving, e.g., by sucking and/or wetting, electrically conductive material into at least a portion of the blind hole by drawing at least a partial vacuum in the vent. In one embodiment, the blind hole can extend through one of the terminals on the workpiece. In this embodiment, the electrically conductive material forms an interconnect that extends through the workpiece and is electrically coupled to the terminal.

Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces

The invention includes deposition apparatuses having reflectors with rugged reflective surfaces configured to disperse light reflected therefrom, and/or having dispersers between lamps and a substrate. The invention also includes optical methods for utilization within a deposition apparatus for assessing the alignment of a substrate within the apparatus and/or for assessing the thickness of a layer of material deposited within the apparatus.

Methods for assessing alignments of substrates within deposition apparatuses; and methods for assessing thicknesses of deposited layers within deposition apparatuses

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Nampa, ID, United States of America

Ross S Dando